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Preparation and electrical characterization of silicon structures formed by wafer bonding /

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Bibliographic Details
Main Author:	Bengtsson, Stefan
Format:	Thesis Book
Language:	English
Published:	Göteborg : Chalmers Tekniska Högskola, 1991
Edition:	1st ed.
Series:	TECHNICAL report No. 223
Subjects:	rozhranie > spájanie > adhezívna vrstva > elektrochémia > polovodičová elektronika
ISBN:	917032655X
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