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Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...

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Podrobná bibliografie
Hlavní autor:	Lau, John H. (Autor)
Médium:	Elektronický zdroj E-kniha
Jazyk:	angličtina
Vydáno:	Singapore : Springer Singapore , 2018.
Vydání:	1st ed. 2018.
Témata:	Electronic circuits. Nanotechnology. Optical materials. Electronic materials.
ISBN:	9789811088841
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