Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...

Full description

Bibliographic Details

Main Author:	Lau, John H. (Author)
Format:	Electronic eBook
Language:	English
Published:	Singapore : Springer Singapore , 2018.
Edition:	1st ed. 2018.
Subjects:	Electronic circuits. Nanotechnology. Optical materials. Electronic materials.
ISBN:	9789811088841
Online Access:
Tags:	Add Tag No Tags, Be the first to tag this record!