Tangible, embedded, and embodied interaction : TEI '15 ; proceedings of the 9th international conference, Stanford, CA, USA, January 15-19, 2015 /

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Bibliographic Details
Corporate Authors: Association for Computing Machinery, ACM (New York City, USA) (Originator), Tangible, embedded, and embodied interaction
Format: Conference Proceeding Book
Language:English
Published: New York : ACM - Association for Computing Machinery, 2015
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ISBN:9781450334037
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Call Number: Z001259
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