Pyramidal MicroLEDs in the Same Material System Delivering RGB
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| Title: | Pyramidal MicroLEDs in the Same Material System Delivering RGB |
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| Authors: | Martinovic, I., Hsu, C. W., Le, S. P., Svensson, Christer, Vorobiev, Andrei, 1963, Tseng, Eric, Holtz, P. O., Rullik, Lisa |
| Source: | International Symposium, Seminar, and Exhibition, Display Week 2025, San Jose, USA Digest of Technical Papers - SID International Symposium. 56(1):336-338 |
| Subject Terms: | HUD, Hybridization, HMD, MicroLED, Pyramidal LED, CMOS, MicroDisplay, InGaN/GaN, RGB |
| Description: | An innovative microLED technology based on a novel bottom-up growth technique is demonstrated. The novel technology allows for overcoming main fundamental limitations hindering further development of microLEDs. The technology allows for RGB emission within a single materials system (InGaN/GaN). Blue and green emissions have earlier been demonstrated, but now also a red emission peaking at 635nm is realized. The technology is suited for hybridization with extremely high accuracy, using a cold-bonding flip-chip method. MicroLED technology based on the pyramidal architecture is promising for manufacturing of micro displays for applications such as Head-Mounted-Displays (HMDs) and HeadUp-Displays (HUDs). |
| Access URL: | https://research.chalmers.se/publication/548934 |
| Database: | SwePub |
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Nájsť tento článok vo Web of Science | Abstract: | An innovative microLED technology based on a novel bottom-up growth technique is demonstrated. The novel technology allows for overcoming main fundamental limitations hindering further development of microLEDs. The technology allows for RGB emission within a single materials system (InGaN/GaN). Blue and green emissions have earlier been demonstrated, but now also a red emission peaking at 635nm is realized. The technology is suited for hybridization with extremely high accuracy, using a cold-bonding flip-chip method. MicroLED technology based on the pyramidal architecture is promising for manufacturing of micro displays for applications such as Head-Mounted-Displays (HMDs) and HeadUp-Displays (HUDs). |
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| ISSN: | 21680159 0097966X |
| DOI: | 10.1002/sdtp.18160 |