Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles
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| Název: | Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles |
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| Autoři: | Du, Leiming, Liu, Kai, Hu, Dong, Bäcke, Olof, 1984, Hu, Xiao, Ji, Xinrui, Fan, Jiajie, Poelma, René H., Hörnqvist Colliander, Magnus, 1979, Zhang, Guo Qi |
| Zdroj: | Acta Materialia. 287 |
| Témata: | Sintered Cu nanoparticles, Micro-cantilever bending tests, Anisotropy, Molecular dynamics simulation, 3D reconstruction |
| Popis: | The mechanical strength of sintered nanoparticles (NPs) limits their application in advanced electronics packaging. In this study, we explore the anisotropy in the microstructure and mechanical properties of sintered copper (Cu) NPs by combining experimental techniques with molecular dynamics (MD) simulations. We establish a clear relationship between processing conditions, microstructural evolution, and resulting properties in pressure-assisted sintering of Cu NPs. Our findings reveal that pressure-assisted sintering induces significant anisotropy in the microstructure, as evidenced by variations in areal relative density and the orientation distribution of necks formed during sintering. Specifically, along the direction of applied pressure, the microstructure exhibits reduced variation in areal relative density and a higher prevalence of necks with favorable orientations. The resulting anisotropic mechanical properties, with significantly higher strength along the pressure direction compared to other directions, are demonstrated through micro-cantilever bending tests and tensile simulations. This anisotropy is further explained by the combined effects of strain localization (influenced by areal relative density) and the failure modes of necks (determined by their orientation relative to the loading direction). This work provides valuable insights into the analysis of sintered NPs microstructures and offers guidance for optimizing the sintering process. |
| Popis souboru: | electronic |
| Přístupová URL adresa: | https://research.chalmers.se/publication/545136 https://research.chalmers.se/publication/545136/file/545136_Fulltext.pdf |
| Databáze: | SwePub |
| Abstrakt: | The mechanical strength of sintered nanoparticles (NPs) limits their application in advanced electronics packaging. In this study, we explore the anisotropy in the microstructure and mechanical properties of sintered copper (Cu) NPs by combining experimental techniques with molecular dynamics (MD) simulations. We establish a clear relationship between processing conditions, microstructural evolution, and resulting properties in pressure-assisted sintering of Cu NPs. Our findings reveal that pressure-assisted sintering induces significant anisotropy in the microstructure, as evidenced by variations in areal relative density and the orientation distribution of necks formed during sintering. Specifically, along the direction of applied pressure, the microstructure exhibits reduced variation in areal relative density and a higher prevalence of necks with favorable orientations. The resulting anisotropic mechanical properties, with significantly higher strength along the pressure direction compared to other directions, are demonstrated through micro-cantilever bending tests and tensile simulations. This anisotropy is further explained by the combined effects of strain localization (influenced by areal relative density) and the failure modes of necks (determined by their orientation relative to the loading direction). This work provides valuable insights into the analysis of sintered NPs microstructures and offers guidance for optimizing the sintering process. |
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| ISSN: | 13596454 |
| DOI: | 10.1016/j.actamat.2025.120772 |
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