A computational multiscale approach towards the modelling of microstructures with material interfaces in electrical conductors
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| Název: | A computational multiscale approach towards the modelling of microstructures with material interfaces in electrical conductors |
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| Autoři: | Güzel, Dilek, Kaiser, Tobias, Menzel, Andreas |
| Přispěvatelé: | Lund University, Faculty of Engineering, LTH, Departments at LTH, Department of Construction Sciences, Solid Mechanics, Lunds universitet, Lunds Tekniska Högskola, Institutioner vid LTH, Institutionen för byggvetenskaper, Hållfasthetslära, Originator |
| Zdroj: | Mathematics and Mechanics of Solids. 30(2):247-266 |
| Témata: | Engineering and Technology, Mechanical Engineering, Applied Mechanics, Teknik, Maskinteknik, Teknisk mekanik, Natural Sciences, Mathematical Sciences, Computational Mathematics, Naturvetenskap, Matematik, Beräkningsmatematik |
| Popis: | Motivated by the change of effective electrical properties grain or phase boundaries, a computational multiscale framework for continua with interfaces at the microscale is proposed. Cohesive-type interfaces are considered at the microscale, such that displacement and electrical potential jumps are accounted for. The governing equations for materials with interfaces under mechanical and electrical loads are provided. Based on these, a computational multiscale formulation is proposed. The coupling between the electrical and mechanical subproblem is established by the constitutive equations at the material interface. In order to investigate deformation-induced property changes at the microscale, the evolution of interface damage is elaborated. The proposed multiscale framework is further examined through various representative boundary value problems so as to identify its key properties. |
| Přístupová URL adresa: | https://doi.org/10.1177/10812865231202721 |
| Databáze: | SwePub |
Nájsť tento článok vo Web of Science | Abstrakt: | Motivated by the change of effective electrical properties grain or phase boundaries, a computational multiscale framework for continua with interfaces at the microscale is proposed. Cohesive-type interfaces are considered at the microscale, such that displacement and electrical potential jumps are accounted for. The governing equations for materials with interfaces under mechanical and electrical loads are provided. Based on these, a computational multiscale formulation is proposed. The coupling between the electrical and mechanical subproblem is established by the constitutive equations at the material interface. In order to investigate deformation-induced property changes at the microscale, the evolution of interface damage is elaborated. The proposed multiscale framework is further examined through various representative boundary value problems so as to identify its key properties. |
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| ISSN: | 10812865 17413028 |
| DOI: | 10.1177/10812865231202721 |