Thermal Side-Channel Threats in Densely Integrated Microarchitectures: A Comprehensive Review for Cyber–Physical System Security
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| Title: | Thermal Side-Channel Threats in Densely Integrated Microarchitectures: A Comprehensive Review for Cyber–Physical System Security |
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| Publisher Information: | 2025. |
| Publication Year: | 2025 |
| Subject Terms: | Hardware and Architecture, Artificial Intelligence, Physical Unclonable Functions (PUFs) and Hardware Security, Cryptographic Implementations and Security, Electrical and Electronic Engineering, Advancements in Semiconductor Devices and Circuit Design |
| Document Type: | Article |
| DOI: | 10.3390/mi16101152 |
| Access URL: | https://publications.polymtl.ca/69104/ |
| Accession Number: | edsair.od......1572..6b149a22100037170abfa450658ea1b7 |
| Database: | OpenAIRE |
Nájsť tento článok vo Web of Science | DOI: | 10.3390/mi16101152 |
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