Bibliographische Detailangaben
| Titel: |
A Novel Digital Design Framework for Power Module Packaging Optimization Using Data-Driven Modeling and Intelligent Optimization Techniques |
| Autoren: |
Ruijie Liu, Haifa Qiu, Ben Tian, Deyi Chen, Xinyuan Wang, Jianming Xu, Yun Mou, Quanxue Guan |
| Quelle: |
2025 26th International Conference on Electronic Packaging Technology (ICEPT). :1-5 |
| Verlagsinformationen: |
IEEE, 2025. |
| Publikationsjahr: |
2025 |
| Publikationsart: |
Article |
| DOI: |
10.1109/icept67137.2025.11157566 |
| Rights: |
STM Policy #29 |
| Dokumentencode: |
edsair.doi...........1b8a3f524c7676cbd49b1492cd403b35 |
| Datenbank: |
OpenAIRE |
Nájsť tento článok vo Web of Science