HUG meeting

The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was ma...

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Podrobná bibliografia

Vydané v:	Printed Circuit Fabrication Ročník 22; číslo 11; s. 104
Hlavný autor:	Fellman, Jack
Médium:	Journal Article Trade Publication Article
Jazyk:	English
Vydavateľské údaje:	San Francisco Printed Circuit Engineering Association, Inc 01.11.1999
Predmet:	Alloys Conferences Interconnect Printed circuit boards R&D Research & development Trends United States > US
ISSN:	0274-8096
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