HUG meeting

The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was ma...

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Vydané v:Printed Circuit Fabrication Ročník 22; číslo 11; s. 104
Hlavný autor: Fellman, Jack
Médium: Journal Article Trade Publication Article
Jazyk:English
Vydavateľské údaje: San Francisco Printed Circuit Engineering Association, Inc 01.11.1999
Predmet:
Alloys
Conferences
Interconnect
Printed circuit boards
R&D
Research & development
Trends
United States > US
ISSN:0274-8096
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Shrnutí:The Hot Air Leveling User Group met at Manchester, NH, for its third meeting of 1999. More than 42 members and guests attended and listened to the results of Phase II testing and the state of the global lead-free solder program. A presentation on the first commercial lead-free solver, CASTIN, was made. A hot air leveling defect guide was distributed for comments by members. Also held was a thorough discussion of suggestions for Phase III testing.
Bibliografia:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0274-8096