고속 반도체 패키지 및 PCB 내 공통 모드 잡음 감쇠를 위한 소형화 된 인덕턴스 향상 파형 접지면 기반 차동 신호선

In this paper, we present a miniaturized differential line (DL) using inductance-enhanced corrugated ground planes (LCGP) for effective common-mode (CM) noise suppression in high-speed packages and printed circuit boards. The LCGP -DL demonstrates the CM noise suppression in the frequency range from...

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Vydáno v:	한국항행학회논문지 Ročník 28; číslo 2; s. 246 - 249
Hlavní autoři:	Tae-soo Park, Myunghoi Kim
Médium:	Journal Article
Jazyk:	korejština
Vydáno:	한국항행학회 30.04.2024
Témata:	Common mode noise Corrugated ground plane Differential line Electromagnetic bandgap Corrugated ground plane Electromagnetic bandgap Common mode noise Differential line
ISSN:	1226-9026, 2288-842X
On-line přístup:	Získat plný text
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