고속 반도체 패키지 및 PCB 내 공통 모드 잡음 감쇠를 위한 소형화 된 인덕턴스 향상 파형 접지면 기반 차동 신호선

In this paper, we present a miniaturized differential line (DL) using inductance-enhanced corrugated ground planes (LCGP) for effective common-mode (CM) noise suppression in high-speed packages and printed circuit boards. The LCGP -DL demonstrates the CM noise suppression in the frequency range from...

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Vydané v:한국항행학회논문지 Ročník 28; číslo 2; s. 246 - 249
Hlavní autori: Tae-soo Park, Myunghoi Kim
Médium: Journal Article
Jazyk:Korean
Vydavateľské údaje: 한국항행학회 30.04.2024
Predmet:
Common mode noise
Corrugated ground plane
Differential line
Electromagnetic bandgap
Corrugated ground plane
Electromagnetic bandgap
Common mode noise
Differential line
ISSN:1226-9026, 2288-842X
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Abstract In this paper, we present a miniaturized differential line (DL) using inductance-enhanced corrugated ground planes (LCGP) for effective common-mode (CM) noise suppression in high-speed packages and printed circuit boards. The LCGP -DL demonstrates the CM noise suppression in the frequency range from 2.09 GHz to 3.6 GHz. Furthermore, to achieve the same low cutoff frequency, the LCGP-DL accomplishes a remarkable 23.2% reduction in size compared to a reference DL.
AbstractList In this paper, we present a miniaturized differential line (DL) using inductance-enhanced corrugated ground planes (LCGP) for effective common-mode (CM) noise suppression in high-speed packages and printed circuit boards. The LCGP-DL demonstrates the CM noise suppression in the frequency range from 2.09 GHz to 3.6 GHz. Furthermore, to achieve the same low cutoff frequency, the LCGP-DL accomplishes a remarkable 23.2% reduction in size compared to a reference DL.
Author Tae-soo Park
Myunghoi Kim
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Electromagnetic bandgap
Common mode noise
Differential line
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SubjectTerms Common mode noise
Corrugated ground plane
Differential line
Electromagnetic bandgap
Title 고속 반도체 패키지 및 PCB 내 공통 모드 잡음 감쇠를 위한 소형화 된 인덕턴스 향상 파형 접지면 기반 차동 신호선
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