Active thermal loading control of the modular multilevel converter by a multi-objective optimization method

The modular multilevel converter (MMC) has become the most attractive converter topology for medium/high-power applications. However, uneven power loss distribution and thermal loading among the semiconductor devices of each submodule (SM) compromise the reliability and lifetime of the converter. In...

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Vydané v:	IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society s. 4482 - 4487
Hlavní autori:	Qichen Yang, Saeedifard, Maryam
Médium:	Konferenčný príspevok..
Jazyk:	English
Vydavateľské údaje:	IEEE 01.10.2017
Predmet:	Capacitors Current control Integrated circuits Junctions Modulation Voltage control
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