Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique

A chip to package interaction risk assessment platform has been developed using finite element analysis, meta-modeling and genetic algorithm optimization method to tackle increasing variations in package specifications. The results show that the meta-model can efficiently predict BEOL peeling stress...

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Vydané v:	IEEE International Reliability Physics Symposium proceedings s. 1 - 6
Hlavní autori:	Lee, Moon Soo, Baick, Inhak, Kim, Min, Kwon, Seo Hyun, Yeo, Myeong Soo, Rhee, Hwasung, Lee, Euncheol
Médium:	Konferenčný príspevok..
Jazyk:	English
Vydavateľské údaje:	IEEE 01.03.2021
Predmet:	Chip packaging interaction Finite element modeling Meta-modeling Metamodeling Multi-objective optimization Reliability Risk management Semiconductor device modeling Stress Tensile stress Ultralow-k dielectric
ISSN:	1938-1891
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