APA (7th ed.) Citation

Lee, M. S., Baick, I., Kim, M., Kwon, S. H., Yeo, M. S., Rhee, H., & Lee, E. (2021, March). Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique. IEEE International Reliability Physics Symposium proceedings, 1-6. https://doi.org/10.1109/IRPS46558.2021.9405133

Chicago Style (17th ed.) Citation

Lee, Moon Soo, Inhak Baick, Min Kim, Seo Hyun Kwon, Myeong Soo Yeo, Hwasung Rhee, and Euncheol Lee. "Chip to Package Interaction Risk Assessment of FCBGA Devices Using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique." IEEE International Reliability Physics Symposium Proceedings Mar. 2021: 1-6. https://doi.org/10.1109/IRPS46558.2021.9405133.

MLA (9th ed.) Citation

Lee, Moon Soo, et al. "Chip to Package Interaction Risk Assessment of FCBGA Devices Using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique." IEEE International Reliability Physics Symposium Proceedings, Mar. 2021, pp. 1-6, https://doi.org/10.1109/IRPS46558.2021.9405133.