Lee, M. S., Baick, I., Kim, M., Kwon, S. H., Yeo, M. S., Rhee, H., & Lee, E. (2021, March). Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique. IEEE International Reliability Physics Symposium proceedings, 1-6. https://doi.org/10.1109/IRPS46558.2021.9405133
Chicago-Zitierstil (17. Ausg.)Lee, Moon Soo, Inhak Baick, Min Kim, Seo Hyun Kwon, Myeong Soo Yeo, Hwasung Rhee, und Euncheol Lee. "Chip to Package Interaction Risk Assessment of FCBGA Devices Using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique." IEEE International Reliability Physics Symposium Proceedings Mar. 2021: 1-6. https://doi.org/10.1109/IRPS46558.2021.9405133.
MLA-Zitierstil (9. Ausg.)Lee, Moon Soo, et al. "Chip to Package Interaction Risk Assessment of FCBGA Devices Using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique." IEEE International Reliability Physics Symposium Proceedings, Mar. 2021, pp. 1-6, https://doi.org/10.1109/IRPS46558.2021.9405133.