Lee, M. S., Baick, I., Kim, M., Kwon, S. H., Yeo, M. S., Rhee, H., & Lee, E. (2021, March). Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique. IEEE International Reliability Physics Symposium proceedings, 1-6. https://doi.org/10.1109/IRPS46558.2021.9405133
Citace podle Chicago (17th ed.)Lee, Moon Soo, Inhak Baick, Min Kim, Seo Hyun Kwon, Myeong Soo Yeo, Hwasung Rhee, a Euncheol Lee. "Chip to Package Interaction Risk Assessment of FCBGA Devices Using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique." IEEE International Reliability Physics Symposium Proceedings Mar. 2021: 1-6. https://doi.org/10.1109/IRPS46558.2021.9405133.
Citace podle MLA (9th ed.)Lee, Moon Soo, et al. "Chip to Package Interaction Risk Assessment of FCBGA Devices Using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique." IEEE International Reliability Physics Symposium Proceedings, Mar. 2021, pp. 1-6, https://doi.org/10.1109/IRPS46558.2021.9405133.