3D modeling based on current continuity for STM carrier profiling of semiconductor devices
Current continuity based 3D modeling of STM carrier profiling of semiconductor devices is achieved for the first time. Tunnel currents between probe tip and devices are solved consistently with current continuity consideration. It is revealed that tunnel current is reduced in current continuity mode...
Uložené v:
| Vydané v: | 2011 International Conference on Simulation of Semiconductor Processes and Devices s. 259 - 262 |
|---|---|
| Hlavní autori: | , , , , , , , |
| Médium: | Konferenčný príspevok.. |
| Jazyk: | English Japanese |
| Vydavateľské údaje: |
IEEE
01.09.2011
|
| Predmet: | |
| ISBN: | 9781612844190, 1612844197 |
| ISSN: | 1946-1569 |
| On-line prístup: | Získať plný text |
| Tagy: |
Pridať tag
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
|
Buďte prvý, kto okomentuje tento záznam!

