Simulation of Thermodynamic Effect for Packaged Enclosures

LDMOS power tubes have a wide range of applications in electronic systems such as radar, communication base stations, wireless broadcasting towers, etc. However, with the increase in operating power, the requirements for heat dissipation and reliability of the packaged enclosure are also more severe...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Digest - IEEE Antennas and Propagation Society. International Symposium (1995) S. 487 - 488
Hauptverfasser:	Peng, Yan, Song, Kexin, Zhang, Tiancheng, Bao, Huaguang, Ding, Dazhi, Yang, Jian
Format:	Tagungsbericht
Sprache:	Englisch
Veröffentlicht:	IEEE 14.07.2024
Schlagworte:	Couplings Deformation Electronic packaging finite difference time domain method multi-physical simulation Software Software algorithms Temperature distribution thermodynamic effect Thermodynamics Wireless communication
ISSN:	1947-1491
Online-Zugang:	Volltext
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