Simulation of Thermodynamic Effect for Packaged Enclosures
LDMOS power tubes have a wide range of applications in electronic systems such as radar, communication base stations, wireless broadcasting towers, etc. However, with the increase in operating power, the requirements for heat dissipation and reliability of the packaged enclosure are also more severe...
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| Veröffentlicht in: | Digest - IEEE Antennas and Propagation Society. International Symposium (1995) S. 487 - 488 |
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| Format: | Tagungsbericht |
| Sprache: | Englisch |
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IEEE
14.07.2024
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| ISSN: | 1947-1491 |
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| Abstract | LDMOS power tubes have a wide range of applications in electronic systems such as radar, communication base stations, wireless broadcasting towers, etc. However, with the increase in operating power, the requirements for heat dissipation and reliability of the packaged enclosure are also more severe. Therefore, in this paper, a thermodynamic coupling method is proposed to analyze the multilayer ceramic housings with the finite difference time domain method. By setting the temperature load, fixed displacement and other boundary conditions, the deformation distribution of the encapsulated shell can be obtained. Thus, the accuracy and the efficiency of the proposed algorithm are verified by comparing the numerical simulation with the commercial software. |
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| AbstractList | LDMOS power tubes have a wide range of applications in electronic systems such as radar, communication base stations, wireless broadcasting towers, etc. However, with the increase in operating power, the requirements for heat dissipation and reliability of the packaged enclosure are also more severe. Therefore, in this paper, a thermodynamic coupling method is proposed to analyze the multilayer ceramic housings with the finite difference time domain method. By setting the temperature load, fixed displacement and other boundary conditions, the deformation distribution of the encapsulated shell can be obtained. Thus, the accuracy and the efficiency of the proposed algorithm are verified by comparing the numerical simulation with the commercial software. |
| Author | Bao, Huaguang Peng, Yan Zhang, Tiancheng Ding, Dazhi Yang, Jian Song, Kexin |
| Author_xml | – sequence: 1 givenname: Yan surname: Peng fullname: Peng, Yan organization: Nanjing University of Science and Technology,Nanjing,China – sequence: 2 givenname: Kexin surname: Song fullname: Song, Kexin organization: Nanjing University of Science and Technology,Nanjing,China – sequence: 3 givenname: Tiancheng surname: Zhang fullname: Zhang, Tiancheng email: tczhang@njust.edu.cn organization: Nanjing University of Science and Technology,Nanjing,China – sequence: 4 givenname: Huaguang surname: Bao fullname: Bao, Huaguang organization: Nanjing University of Science and Technology,Nanjing,China – sequence: 5 givenname: Dazhi surname: Ding fullname: Ding, Dazhi organization: Nanjing University of Science and Technology,Nanjing,China – sequence: 6 givenname: Jian surname: Yang fullname: Yang, Jian organization: Nanjing Solid State Devices Co,Nanjing,China |
| BookMark | eNo1j0tOwzAUAA0Cibb0BixyAbd-fvHnsauiAJUqqEi7rhzHhkCToCRd9PYIAZuZ3UgzZVdt1wbGOIgFgKDlasuL5fo54_viB6_FWkmh0oUUMl2A0NYA4gWbkyGLSqAmEvaSTYBSwyEluGHTYfgQQqIBNWH3Rd2cjm6suzbpYrJ7D33TVefWNbVP8hiDH5PY9cnW-U_3Fqokb_2xG059GG7ZdXTHIcz_PGP7h3yXPfHNy-M6W214DUaPHMhHg6WniIpQKC28QGetlNZJpaAMFiTo1JGvqKywMh7Q6UhV1KWigDN299utQwiHr75uXH8-_L_iN2faTiE |
| ContentType | Conference Proceeding |
| DBID | 6IE 6IH CBEJK RIE RIO |
| DOI | 10.1109/AP-S/INC-USNC-URSI52054.2024.10687133 |
| DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan (POP) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Xplore IEEE Proceedings Order Plans (POP) 1998-present |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: RIE name: IEEE Xplore url: https://ieeexplore.ieee.org/ sourceTypes: Publisher |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISBN | 9798350369908 |
| EISSN | 1947-1491 |
| EndPage | 488 |
| ExternalDocumentID | 10687133 |
| Genre | orig-research |
| GrantInformation_xml | – fundername: National Natural Science Foundation of China grantid: 62025109,62201257,92373108 funderid: 10.13039/501100001809 |
| GroupedDBID | 23M 6IE 6IF 6IH 6IK 6IL 6IM 6IN AAJGR AAWTH ABLEC ACGFS ADZIZ ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CBEJK CHZPO IEGSK IJVOP IPLJI M43 OCL RIE RIL RIO RNS |
| ID | FETCH-LOGICAL-i176t-19cf73bc9f35930560c03a88228a2551be812164a9cd9bd3d7c13a6f9df6b59e3 |
| IEDL.DBID | RIE |
| ISICitedReferencesCount | 0 |
| ISICitedReferencesURI | http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=001368605100237&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D |
| IngestDate | Wed Aug 27 02:18:28 EDT 2025 |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-i176t-19cf73bc9f35930560c03a88228a2551be812164a9cd9bd3d7c13a6f9df6b59e3 |
| PageCount | 2 |
| ParticipantIDs | ieee_primary_10687133 |
| PublicationCentury | 2000 |
| PublicationDate | 2024-July-14 |
| PublicationDateYYYYMMDD | 2024-07-14 |
| PublicationDate_xml | – month: 07 year: 2024 text: 2024-July-14 day: 14 |
| PublicationDecade | 2020 |
| PublicationTitle | Digest - IEEE Antennas and Propagation Society. International Symposium (1995) |
| PublicationTitleAbbrev | AP-S/INC-USNC-URSI |
| PublicationYear | 2024 |
| Publisher | IEEE |
| Publisher_xml | – name: IEEE |
| SSID | ssj0023715 |
| Score | 1.8761386 |
| Snippet | LDMOS power tubes have a wide range of applications in electronic systems such as radar, communication base stations, wireless broadcasting towers, etc.... |
| SourceID | ieee |
| SourceType | Publisher |
| StartPage | 487 |
| SubjectTerms | Couplings Deformation Electronic packaging finite difference time domain method multi-physical simulation Software Software algorithms Temperature distribution thermodynamic effect Thermodynamics Wireless communication |
| Title | Simulation of Thermodynamic Effect for Packaged Enclosures |
| URI | https://ieeexplore.ieee.org/document/10687133 |
| WOSCitedRecordID | wos001368605100237&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV07T8MwED7RCiFYeBXxlgdWt0kcxzEbQq1gqSJCpW6Vn1IFTVCb8vuxk7TAwMBiRR6s6HL23XfxfR_AHRUuqVBWY-cbMY7DyGJBaYqlVEJz5UImbcQm2HicTqc8a5vV614YY0x9-cz0_WP9L1-Xau1LZW6HJ6kHVR3oMJY0zVpbdEVYSPcAtySag4cM5wMHjPEk98NL_kyjoK6iRHF_s9AvSZU6oowO__kuR9D77s1D2TbqHMOOKU7g4Aet4Cnc5_NFq8qFSoucJywXpW6k51FDV4xcrooyod7ccaLRsFDvpS8VrnowGQ1fH59wq5GA5yFLKhxyZRmRiltCuYcDgQqIcGlzlAqHFkJpXAR3kEhwpbnURDMVEpFYrm0iKTfkDLpFWZhzQNwlM4ZKFgiduG2deuZ5TUQkbUAMYfYCet4Ms4-GBmO2scDlH_NXsO-N7QuhYXwN3Wq5Njewqz6r-Wp5W3-8L8NLmQM |
| linkProvider | IEEE |
| linkToHtml | http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3JTsMwEB1BQSwXtiJ2fODqksRxEnNDqFUrShWRVuqt8ipV0AR14fuxk7bAgQMXK_LBiiZjz7yJ5z2AO8ptUiGNwtY3Qhz6gcGc0gQLIbli0oZMWolNxL1eMhyydNmsXvbCaK3Ly2e64R7Lf_mqkAtXKrM7PEocqNqELRqGgVe1a63xFYl9ugN4SaN5_5ji7N5CYzzI3PCadWjglXWUIGyslvolqlLGlNbBP9_mEOrf3XkoXcedI9jQ-THs_yAWPIGHbDxZ6nKhwiDrC9NJoSrxeVQRFiObraKUyzd7oCjUzOV74YqFszoMWs3-UxsvVRLw2I-jOfaZNDERkhlCmQMEnvQIt4lzkHCLF3yhbQy3oIgzqZhQRMXSJzwyTJlIUKbJKdTyItdngJhNZzQVscdVZDd24rjnFeGBMB7RJDbnUHdmGH1URBijlQUu_pi_hd12_6U76nZ6z5ew5wzvyqJ-eAW1-XShr2Fbfs7Hs-lN-SG_AOvinEo |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Digest+-+IEEE+Antennas+and+Propagation+Society.+International+Symposium+%281995%29&rft.atitle=Simulation+of+Thermodynamic+Effect+for+Packaged+Enclosures&rft.au=Peng%2C+Yan&rft.au=Song%2C+Kexin&rft.au=Zhang%2C+Tiancheng&rft.au=Bao%2C+Huaguang&rft.date=2024-07-14&rft.pub=IEEE&rft.eissn=1947-1491&rft.spage=487&rft.epage=488&rft_id=info:doi/10.1109%2FAP-S%2FINC-USNC-URSI52054.2024.10687133&rft.externalDocID=10687133 |