Peng, Y., Song, K., Zhang, T., Bao, H., Ding, D., & Yang, J. (2024, July 14). Simulation of Thermodynamic Effect for Packaged Enclosures. Digest - IEEE Antennas and Propagation Society. International Symposium (1995), 487-488. https://doi.org/10.1109/AP-S/INC-USNC-URSI52054.2024.10687133
Citace podle Chicago (17th ed.)Peng, Yan, Kexin Song, Tiancheng Zhang, Huaguang Bao, Dazhi Ding, a Jian Yang. "Simulation of Thermodynamic Effect for Packaged Enclosures." Digest - IEEE Antennas and Propagation Society. International Symposium (1995) 14 Jul. 2024: 487-488. https://doi.org/10.1109/AP-S/INC-USNC-URSI52054.2024.10687133.
Citace podle MLA (9th ed.)Peng, Yan, et al. "Simulation of Thermodynamic Effect for Packaged Enclosures." Digest - IEEE Antennas and Propagation Society. International Symposium (1995), 14 Jul. 2024, pp. 487-488, https://doi.org/10.1109/AP-S/INC-USNC-URSI52054.2024.10687133.