Highly Plasmonic Titanium Nitride by Room-Temperature Sputtering

Titanium nitride (TiN) has recently emerged as an attractive alternative material for plasmonics. However, the typical high-temperature deposition of plasmonic TiN using either sputtering or atomic layer deposition has greatly limited its potential applications and prevented its integration into exi...

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Bibliographic Details
Published in:Scientific reports Vol. 9; no. 1; pp. 15287 - 9
Main Authors: Chang, Chun-Chieh, Nogan, John, Yang, Zu-Po, Kort-Kamp, Wilton J. M., Ross, Willard, Luk, Ting S., Dalvit, Diego A. R., Azad, Abul K., Chen, Hou-Tong
Format: Journal Article
Language:English
Published: London Nature Publishing Group UK 25.10.2019
Nature Publishing Group
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ISSN:2045-2322, 2045-2322
Online Access:Get full text
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