Special issue of computational mechanics on machine learning theories, modeling, and applications to computational materials science, additive manufacturing, mechanics of materials, design and optimization

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Vydané v:Computational mechanics Ročník 72; číslo 1; s. 1 - 2
Hlavní autori: Liu, Wing Kam, Bessa, Miguel A., Chinesta, Francisco, Li, Shaofan, Trask, Nathaniel
Médium: Journal Article
Jazyk:English
Vydavateľské údaje: Berlin/Heidelberg Springer Berlin Heidelberg 01.07.2023
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Audience Academic
Author Trask, Nathaniel
Chinesta, Francisco
Bessa, Miguel A.
Li, Shaofan
Liu, Wing Kam
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  givenname: Wing Kam
  surname: Liu
  fullname: Liu, Wing Kam
  email: w-liu@northwestern.edu
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  givenname: Miguel A.
  surname: Bessa
  fullname: Bessa, Miguel A.
  organization: Brown University
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  givenname: Francisco
  surname: Chinesta
  fullname: Chinesta, Francisco
  organization: ENSAM Institute of Technology
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  givenname: Shaofan
  surname: Li
  fullname: Li, Shaofan
  organization: University of California
– sequence: 5
  givenname: Nathaniel
  surname: Trask
  fullname: Trask, Nathaniel
  organization: Sandia National Laboratories
BackLink https://www.ncbi.nlm.nih.gov/pubmed/37213791$$D View this record in MEDLINE/PubMed
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CitedBy_id crossref_primary_10_1016_j_engfailanal_2025_109505
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Cites_doi 10.2172/1478744
10.1007/978-3-030-87832-0
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References LiuWKGanZFlemingMAMechanistic data science for STEM education and applications2021ChamSpringer10.1007/978-3-030-87832-0
https://www.forbes.com/sites/bernardmarr/2016/12/06/what-is-the-difference-between-artificial-intelligence-and-machine-learning/#2b5dbadf2742
Baker N, Alexander F, Bremer T, Hagberg A, Kevrekidis Y, Najm H, Parashar M, Patra A, Sethian J, Wild S, Willcox K (2019) Workshop report on basic research needs for scientific machine learning: core technologies for artificial intelligence. USDOE Office of Science (SC), Washington, DC (United States)
WK Liu (2337_CR3) 2021
2337_CR1
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SubjectTerms 3D printing
Artificial intelligence
Classical and Continuum Physics
Computational mechanics
Computational Science and Engineering
Design optimization
Editorial
Engineering
Machine learning
Machine vision
Materials science
Theoretical and Applied Mechanics
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