Micro crack detection of multi-crystalline silicon solar wafer using machine vision techniques

Purpose - The detection of invisible micro cracks (μ-cracks) in multi-crystalline silicon (mc-si) solar wafers is difficult because of the wafers' heterogeneously textured backgrounds. The difficulty is twofold. First, invisible μ-cracks must be visualized to imaging devices. Second, an image p...

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Vydané v:	Sensor review Ročník 31; číslo 2; s. 154 - 165
Hlavní autori:	Chiou, Yih-Chih, Liu, Jian-Zong, Liang, Yu-Teng
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	Bradford Emerald Group Publishing Limited 01.01.2011
Predmet:	Acoustics Algorithms Cameras Computer programming Cracks Fiber optics Flaw detection Heat Imaging Inspection Light emitting diodes Methods Photovoltaic cells Quality control Semiconductors Sensors Silicon Silicon wafers Studies Universal Serial Bus Wafers Image sensors Silicon Semiconductor devices Programming and algorithm theory Quality control
ISSN:	0260-2288, 1758-6828
On-line prístup:	Získať plný text
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