Micro crack detection of multi-crystalline silicon solar wafer using machine vision techniques

Purpose - The detection of invisible micro cracks (μ-cracks) in multi-crystalline silicon (mc-si) solar wafers is difficult because of the wafers' heterogeneously textured backgrounds. The difficulty is twofold. First, invisible μ-cracks must be visualized to imaging devices. Second, an image p...

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Veröffentlicht in:	Sensor review Jg. 31; H. 2; S. 154 - 165
Hauptverfasser:	Chiou, Yih-Chih, Liu, Jian-Zong, Liang, Yu-Teng
Format:	Journal Article
Sprache:	Englisch
Veröffentlicht:	Bradford Emerald Group Publishing Limited 01.01.2011
Schlagworte:	Acoustics Algorithms Cameras Computer programming Cracks Fiber optics Flaw detection Heat Imaging Inspection Light emitting diodes Methods Photovoltaic cells Quality control Semiconductors Sensors Silicon Silicon wafers Studies Universal Serial Bus Wafers Image sensors Silicon Semiconductor devices Programming and algorithm theory Quality control
ISSN:	0260-2288, 1758-6828
Online-Zugang:	Volltext
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