Chiou, Y., Liu, J., & Liang, Y. (2011). Micro crack detection of multi-crystalline silicon solar wafer using machine vision techniques. Sensor review, 31(2), 154-165. https://doi.org/10.1108/02602281111110013
Citace podle Chicago (17th ed.)Chiou, Yih-Chih, Jian-Zong Liu, a Yu-Teng Liang. "Micro Crack Detection of Multi-crystalline Silicon Solar Wafer Using Machine Vision Techniques." Sensor Review 31, no. 2 (2011): 154-165. https://doi.org/10.1108/02602281111110013.
Citace podle MLA (9th ed.)Chiou, Yih-Chih, et al. "Micro Crack Detection of Multi-crystalline Silicon Solar Wafer Using Machine Vision Techniques." Sensor Review, vol. 31, no. 2, 2011, pp. 154-165, https://doi.org/10.1108/02602281111110013.
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