3D reconstruction and defect pattern recognition of bonding wire based on stereo vision

Non‐destructive detection of wire bonding defects in integrated circuits (IC) is critical for ensuring product quality after packaging. Image‐processing‐based methods do not provide a detailed evaluation of the three‐dimensional defects of the bonding wire. Therefore, a method of 3D reconstruction a...

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Bibliographic Details
Published in:	CAAI Transactions on Intelligence Technology Vol. 9; no. 2; pp. 348 - 364
Main Authors:	Yu, Naigong, Li, Hongzheng, Xu, Qiao, Sie, Ouattara, Firdaous, Essaf
Format:	Journal Article
Language:	English
Published:	Beijing John Wiley & Sons, Inc 01.04.2024 Wiley
Subjects:	Aircraft Bonding bonding wire Deep learning defect detection Defects Electronic components Feature extraction Image quality Image reconstruction Image segmentation Integrated circuits Manufacturing Methods Pattern recognition point cloud point cloud segmentation Semiconductors Three dimensional models Vision systems Wire
ISSN:	2468-2322, 2468-6557, 2468-2322
Online Access:	Get full text
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