Comparison of thermal performances of plate-fin and pin-fin heat sinks subject to an impinging flow

In this paper, we compare thermal performances of two types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, experimental investigations are per...

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Published in:	International journal of heat and mass transfer Vol. 52; no. 15; pp. 3510 - 3517
Main Authors:	Kim, Dong-Kwon, Kim, Sung Jin, Bae, Jin-Kwon
Format:	Journal Article
Language:	English
Published:	Kidlington Elsevier Ltd 01.07.2009 Elsevier
Subjects:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Heat sink Impinging flow Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Thermal resistance Thermal resistance Impinging flow Heat sink Air flow Pressure drop Electronic component Plate heat exchanger Interaction Cooling system Experimental study Modeling Finned surface Heat transfer
ISSN:	0017-9310, 1879-2189
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Abstract	In this paper, we compare thermal performances of two types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, experimental investigations are performed for various flow rates and channel widths. From experimental data, we suggest a model based on the volume averaging approach for predicting the pressure drop and the thermal resistance. By using the model, thermal resistances of the optimized plate-fin and pin-fin heat sinks are compared. Finally, a contour map, which depicts the ratio of the thermal resistances of the optimized plate-fin and pin-fin heat sinks as a function of dimensionless pumping power and dimensionless length, is presented. The contour map indicates that optimized pin-fin heat sinks possess lower thermal resistances than optimized plate-fin heat sinks when dimensionless pumping power is small and the dimensionless length of heat sinks is large. On the contrary, the optimized plate-fin heat sinks have smaller thermal resistances when dimensionless pumping power is large and the dimensionless length of heat sinks is small.
AbstractList	In this paper, we compare thermal performances of two types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, experimental investigations are performed for various flow rates and channel widths. From experimental data, we suggest a model based on the volume averaging approach for predicting the pressure drop and the thermal resistance. By using the model, thermal resistances of the optimized plate-fin and pin-fin heat sinks are compared. Finally, a contour map, which depicts the ratio of the thermal resistances of the optimized plate-fin and pin-fin heat sinks as a function of dimensionless pumping power and dimensionless length, is presented. The contour map indicates that optimized pin-fin heat sinks possess lower thermal resistances than optimized plate-fin heat sinks when dimensionless pumping power is small and the dimensionless length of heat sinks is large. On the contrary, the optimized plate-fin heat sinks have smaller thermal resistances when dimensionless pumping power is large and the dimensionless length of heat sinks is small.
Author	Bae, Jin-Kwon Kim, Sung Jin Kim, Dong-Kwon
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Keywords	Thermal resistance Impinging flow Heat sink Air flow Pressure drop Electronic component Plate heat exchanger Interaction Cooling system Experimental study Modeling Finned surface Heat transfer
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References	Slattery (bib16) 1999 Duan, Muzychka (bib7) 2006; 128 Oktay, Hannemann, Bar-Cohen (bib1) 1986; 108 Kondo, Matsushima, Ohashi (bib12) 1999; 28 Bejan (bib17) 2004 A. Bar-Cohen, Thermal management of electric components with dielectric liquids, in: J.R. Lloyd, Y. Kurosaki (Eds.), Proceedings of ASME/JSME Thermal Engineering Joint Conference, vol. 2, 1996, pp. 15–39. Kim, Kim, Oh (bib18) 2008; 29 Kondo, Behnia, Nakayama, Matsushima (bib6) 1998 Incropera (bib3) 1988; 110 Kim, Kim (bib15) 2006; 49 Ledezma, Morega, Bejan (bib9) 1996; 118 Issa, Ortega (bib11) 2006; 128 Nakayama (bib4) 1986; 39 Kim, Yoo, Jang (bib14) 2002; 124 Sathe, Kelkar, Karki, Tai, Lamb, Patankar (bib8) 1997; 119 Kondo, Matsushima, Komatsu (bib10) 2000; 122 Biber (bib5) 1997; 20 Li, Chao, Tsai (bib13) 2005; 48 Kim (10.1016/j.ijheatmasstransfer.2009.02.041_bib18) 2008; 29 Kondo (10.1016/j.ijheatmasstransfer.2009.02.041_bib6) 1998 Sathe (10.1016/j.ijheatmasstransfer.2009.02.041_bib8) 1997; 119 Oktay (10.1016/j.ijheatmasstransfer.2009.02.041_bib1) 1986; 108 Incropera (10.1016/j.ijheatmasstransfer.2009.02.041_bib3) 1988; 110 Nakayama (10.1016/j.ijheatmasstransfer.2009.02.041_bib4) 1986; 39 Kondo (10.1016/j.ijheatmasstransfer.2009.02.041_bib10) 2000; 122 Issa (10.1016/j.ijheatmasstransfer.2009.02.041_bib11) 2006; 128 Ledezma (10.1016/j.ijheatmasstransfer.2009.02.041_bib9) 1996; 118 10.1016/j.ijheatmasstransfer.2009.02.041_bib2 Duan (10.1016/j.ijheatmasstransfer.2009.02.041_bib7) 2006; 128 Slattery (10.1016/j.ijheatmasstransfer.2009.02.041_bib16) 1999 Kondo (10.1016/j.ijheatmasstransfer.2009.02.041_bib12) 1999; 28 Kim (10.1016/j.ijheatmasstransfer.2009.02.041_bib15) 2006; 49 Li (10.1016/j.ijheatmasstransfer.2009.02.041_bib13) 2005; 48 Kim (10.1016/j.ijheatmasstransfer.2009.02.041_bib14) 2002; 124 Bejan (10.1016/j.ijheatmasstransfer.2009.02.041_bib17) 2004 Biber (10.1016/j.ijheatmasstransfer.2009.02.041_bib5) 1997; 20
References_xml	– reference: A. Bar-Cohen, Thermal management of electric components with dielectric liquids, in: J.R. Lloyd, Y. Kurosaki (Eds.), Proceedings of ASME/JSME Thermal Engineering Joint Conference, vol. 2, 1996, pp. 15–39. – volume: 29 start-page: 169 year: 2008 end-page: 177 ident: bib18 article-title: Comparison of fluid flow and thermal characteristics of plate-fin and pin-fin heat sinks subject to a parallel flow publication-title: Heat Transfer Eng. – volume: 124 start-page: 1026 year: 2002 end-page: 1033 ident: bib14 article-title: Thermal optimization of a circular-sectored finned tube using a porous medium approach publication-title: J. Heat Transfer – volume: 128 start-page: 412 year: 2006 end-page: 418 ident: bib7 article-title: Experimental investigation of heat transfer in impingement air cooled plate fin heat sinks publication-title: J. Electronic Pack. – year: 2004 ident: bib17 article-title: Convective Heat Transfer – volume: 110 start-page: 1097 year: 1988 end-page: 1111 ident: bib3 article-title: Convection heat transfer in electronic equipment cooling publication-title: J. Heat Transfer – volume: 122 start-page: 240 year: 2000 end-page: 246 ident: bib10 article-title: Optimization of pin fin heat sinks for impingement cooling of electronic packages publication-title: J. Electronic Pack. – volume: 108 start-page: 36 year: 1986 end-page: 42 ident: bib1 article-title: High heat from a small package publication-title: Mech. Eng. – volume: 49 start-page: 695 year: 2006 end-page: 706 ident: bib15 article-title: Averaging approach for microchannel heat sinks subject to the uniform wall temperature condition publication-title: Int. J. Heat Mass Transfer – volume: 20 start-page: 458 year: 1997 end-page: 462 ident: bib5 article-title: Pressure drop and heat transfer in an isothermal channel with impinging flow publication-title: IEEE Trans. Components Pack. Manuf. Technol. A – volume: 48 start-page: 5386 year: 2005 end-page: 5394 ident: bib13 article-title: Thermal performance measurement of heat sinks with confined jet by infrared thermography publication-title: Int. J. Heat Mass Transfer – volume: 118 start-page: 570 year: 1996 end-page: 577 ident: bib9 article-title: Optimal spacing between pin fins with impinging flow publication-title: J. Heat Transfer – volume: 128 start-page: 61 year: 2006 end-page: 70 ident: bib11 article-title: Experimental measurements of the flow and heat transfer of a square jet impinging on an array of square pin fins publication-title: J. Electronic Pack. – year: 1999 ident: bib16 article-title: Advanced Transport Phenomena – volume: 28 start-page: 138 year: 1999 end-page: 151 ident: bib12 article-title: Optimization of heat sink geometries for impingement air-cooling of LSI packages publication-title: Heat Transfer Asian Res. – volume: 39 start-page: 1847 year: 1986 end-page: 1868 ident: bib4 article-title: Thermal management of electronic equipment: a review of technology and research topics publication-title: Appl. Mech. Rev. – start-page: 259 year: 1998 end-page: 266 ident: bib6 article-title: Optimization of finned heat sinks for impingement cooling of electronic packages publication-title: J. Electronic Pack. – volume: 119 start-page: 58 year: 1997 end-page: 63 ident: bib8 article-title: Numerical prediction of flow and heat transfer in an impingement heat sink publication-title: J. Electronic Pack. – year: 2004 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib17 – ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib2 – volume: 108 start-page: 36 issue: 3 year: 1986 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib1 article-title: High heat from a small package publication-title: Mech. Eng. – volume: 122 start-page: 240 year: 2000 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib10 article-title: Optimization of pin fin heat sinks for impingement cooling of electronic packages publication-title: J. Electronic Pack. doi: 10.1115/1.1289761 – volume: 124 start-page: 1026 year: 2002 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib14 article-title: Thermal optimization of a circular-sectored finned tube using a porous medium approach publication-title: J. Heat Transfer doi: 10.1115/1.1495517 – volume: 119 start-page: 58 year: 1997 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib8 article-title: Numerical prediction of flow and heat transfer in an impingement heat sink publication-title: J. Electronic Pack. doi: 10.1115/1.2792201 – volume: 20 start-page: 458 year: 1997 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib5 article-title: Pressure drop and heat transfer in an isothermal channel with impinging flow publication-title: IEEE Trans. Components Pack. Manuf. Technol. A doi: 10.1109/95.650935 – volume: 110 start-page: 1097 year: 1988 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib3 article-title: Convection heat transfer in electronic equipment cooling publication-title: J. Heat Transfer doi: 10.1115/1.3250613 – start-page: 259 year: 1998 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib6 article-title: Optimization of finned heat sinks for impingement cooling of electronic packages publication-title: J. Electronic Pack. doi: 10.1115/1.2792631 – volume: 48 start-page: 5386 year: 2005 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib13 article-title: Thermal performance measurement of heat sinks with confined jet by infrared thermography publication-title: Int. J. Heat Mass Transfer doi: 10.1016/j.ijheatmasstransfer.2005.07.007 – volume: 29 start-page: 169 year: 2008 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib18 article-title: Comparison of fluid flow and thermal characteristics of plate-fin and pin-fin heat sinks subject to a parallel flow publication-title: Heat Transfer Eng. doi: 10.1080/01457630701686669 – volume: 128 start-page: 61 year: 2006 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib11 article-title: Experimental measurements of the flow and heat transfer of a square jet impinging on an array of square pin fins publication-title: J. Electronic Pack. doi: 10.1115/1.2160513 – volume: 128 start-page: 412 year: 2006 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib7 article-title: Experimental investigation of heat transfer in impingement air cooled plate fin heat sinks publication-title: J. Electronic Pack. doi: 10.1115/1.2351906 – volume: 118 start-page: 570 year: 1996 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib9 article-title: Optimal spacing between pin fins with impinging flow publication-title: J. Heat Transfer doi: 10.1115/1.2822670 – volume: 49 start-page: 695 year: 2006 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib15 article-title: Averaging approach for microchannel heat sinks subject to the uniform wall temperature condition publication-title: Int. J. Heat Mass Transfer doi: 10.1016/j.ijheatmasstransfer.2005.08.012 – volume: 39 start-page: 1847 issue: 12 year: 1986 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib4 article-title: Thermal management of electronic equipment: a review of technology and research topics publication-title: Appl. Mech. Rev. doi: 10.1115/1.3149515 – volume: 28 start-page: 138 year: 1999 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib12 article-title: Optimization of heat sink geometries for impingement air-cooling of LSI packages publication-title: Heat Transfer Asian Res. doi: 10.1002/(SICI)1523-149X(1999)28:2<138::AID-HTJ7>3.3.CO;2-V – year: 1999 ident: 10.1016/j.ijheatmasstransfer.2009.02.041_bib16
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SubjectTerms	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Heat sink Impinging flow Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Thermal resistance
Title	Comparison of thermal performances of plate-fin and pin-fin heat sinks subject to an impinging flow
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