Seo, J. (2021). A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization. Journal of materials research, 36(1), 235-257. https://doi.org/10.1557/s43578-020-00060-x
Citácia podle Chicago (17th ed.)Seo, Jihoon. "A Review on Chemical and Mechanical Phenomena at the Wafer Interface During Chemical Mechanical Planarization." Journal of Materials Research 36, no. 1 (2021): 235-257. https://doi.org/10.1557/s43578-020-00060-x.
Citácia podľa MLA (8th ed.)Seo, Jihoon. "A Review on Chemical and Mechanical Phenomena at the Wafer Interface During Chemical Mechanical Planarization." Journal of Materials Research, vol. 36, no. 1, 2021, pp. 235-257, https://doi.org/10.1557/s43578-020-00060-x.
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