Numerical study on flow and heat transfer of a hybrid microchannel cooling scheme using manifold arrangement and secondary channels

•A hybrid design using manifold arrangement and secondary channels for microchannel heat sink is proposed.•A Design Optimization Area (DOA) for the MMC-SOC is defined.•The pressure drop and thermal resistance can be both reduced in DOA.•The best hybrid design with geometrical parameters of (λ = 1, β...

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Vydané v:	Applied thermal engineering Ročník 159; s. 113896
Hlavní autori:	Yang, Min, Cao, Bing-Yang
Médium:	Journal Article
Jazyk:	English
Vydavateľské údaje:	Oxford Elsevier Ltd 01.08.2019 Elsevier BV
Predmet:	Cooling Design optimization Design Optimization Area (DOA) Heat sinks Heat transfer Hybrid design Hydraulic and thermal performance enhancements Manifold arrangement Manifolds Microchannel heat sink Microchannels Pressure drop Pressure loss Reynolds number Secondary channels Secondary flow Temperature Thermal boundary layer Thermal resistance Hybrid design Secondary channels Microchannel heat sink Manifold arrangement Hydraulic and thermal performance enhancements Design Optimization Area (DOA)
ISSN:	1359-4311, 1873-5606
On-line prístup:	Získať plný text
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