CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording

This paper reports on a novel high-density CMOS-based silicon microprobe array for intracortical recording applications. In contrast to existing systems, CMOS multiplexing units are integrated directly on the slender, needle-like probe shafts. Single-shaft probes and four-shaft combs have been reali...

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Veröffentlicht in:	Journal of microelectromechanical systems Jg. 20; H. 6; S. 1439 - 1448
Hauptverfasser:	Seidl, K., Herwik, S., Torfs, T., Neves, H. P., Paul, O., Ruther, P.
Format:	Journal Article
Sprache:	Englisch
Veröffentlicht:	New York, NY IEEE 01.12.2011 Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Schlagworte:	3-D probe arrays Arrays CMOS CMOS circuitry CMOS integrated circuits electrode selection Electrodes Exact sciences and technology Fabrication high-density electrode array Instruments, apparatus, components and techniques common to several branches of physics and astronomy Mechanical instruments, equipment and techniques microelectromechanical systems (MEMS) fabrication Micromechanical devices and systems Multiplexing neural recording Neurons Physics post-CMOS fabrication Recording Silicon silicon microprobes Three dimensional displays Translations Electronic control Microprobe Multiplexing Microelectrodes Interdigital transducers 3-D probe arrays Central nervous system Slender body electrode selection high-density electrode array Shafts post-CMOS fabrication microelectromechanical systems (MEMS) fabrication Neural networks Complementary MOS technology neural recording Needle Silicon silicon microprobes Man CMOS circuitry Microsensors Microelectromechanical device Production process
ISSN:	1057-7157, 1941-0158
Online-Zugang:	Volltext
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