Cause analysis of the faults in HARC etching processes by using the PI‐VM model for OLED display manufacturing

High‐aspect ratio contact (HARC) etching is a bottleneck step of the high‐definition organic light emitting diode (OLED) display manufacturing processes. HARC process is frequently failed during the mass production, because this requires the high‐energy ion flux and the sidewall passivation, simulta...

Celý popis

Uložené v:
Podrobná bibliografia
Vydané v:Plasma processes and polymers Ročník 16; číslo 9
Hlavní autori: Park, Seolhye, Kyung, Yunyoung, Lee, Juyoung, Jang, Yongsuk, Cha, Taewon, Noh, Yeongil, Choi, Younghoon, Kim, Byungsoo, Cho, Taeyoung, Seo, Rabul, Yang, Jae‐Ho, Jang, Yunchang, Ryu, Sangwon, Kim, Gon‐Ho
Médium: Journal Article
Jazyk:English
Vydavateľské údaje: Weinheim Wiley Subscription Services, Inc 01.09.2019
Predmet:
ISSN:1612-8850, 1612-8869
On-line prístup:Získať plný text
Tagy: Pridať tag
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
Abstract High‐aspect ratio contact (HARC) etching is a bottleneck step of the high‐definition organic light emitting diode (OLED) display manufacturing processes. HARC process is frequently failed during the mass production, because this requires the high‐energy ion flux and the sidewall passivation, simultaneously. To analyze the cause of HARC process failures, plasma information (PI)‐based virtual metrology (VM) algorithm was developed by using the equipment engineering system and the optical emission spectroscopy data recorded from the fab. Developed PI‐VM could predict the process faults with >90% of the accuracy, and the cause analysis function was also validated. We could suggest a right solution to the failure, and more efficient management of the OLED display manufacturing was possible. Highly contributed plasma information (PI) parameters to the decision of process failed and succeeded glasses in the virtual metrology model were applied to the root cause analysis of the high‐aspect ratio contact (HARC) etching process faults. Analyzed causes could be a guideline of the mass production control and management in the organic light emitting diodes (OLED) display manufacturing fab.
AbstractList High‐aspect ratio contact (HARC) etching is a bottleneck step of the high‐definition organic light emitting diode (OLED) display manufacturing processes. HARC process is frequently failed during the mass production, because this requires the high‐energy ion flux and the sidewall passivation, simultaneously. To analyze the cause of HARC process failures, plasma information (PI)‐based virtual metrology (VM) algorithm was developed by using the equipment engineering system and the optical emission spectroscopy data recorded from the fab. Developed PI‐VM could predict the process faults with >90% of the accuracy, and the cause analysis function was also validated. We could suggest a right solution to the failure, and more efficient management of the OLED display manufacturing was possible.
High‐aspect ratio contact (HARC) etching is a bottleneck step of the high‐definition organic light emitting diode (OLED) display manufacturing processes. HARC process is frequently failed during the mass production, because this requires the high‐energy ion flux and the sidewall passivation, simultaneously. To analyze the cause of HARC process failures, plasma information (PI)‐based virtual metrology (VM) algorithm was developed by using the equipment engineering system and the optical emission spectroscopy data recorded from the fab. Developed PI‐VM could predict the process faults with >90% of the accuracy, and the cause analysis function was also validated. We could suggest a right solution to the failure, and more efficient management of the OLED display manufacturing was possible. Highly contributed plasma information (PI) parameters to the decision of process failed and succeeded glasses in the virtual metrology model were applied to the root cause analysis of the high‐aspect ratio contact (HARC) etching process faults. Analyzed causes could be a guideline of the mass production control and management in the organic light emitting diodes (OLED) display manufacturing fab.
Author Kyung, Yunyoung
Jang, Yunchang
Park, Seolhye
Lee, Juyoung
Seo, Rabul
Jang, Yongsuk
Choi, Younghoon
Kim, Byungsoo
Ryu, Sangwon
Noh, Yeongil
Kim, Gon‐Ho
Cha, Taewon
Cho, Taeyoung
Yang, Jae‐Ho
Author_xml – sequence: 1
  givenname: Seolhye
  orcidid: 0000-0002-5957-1532
  surname: Park
  fullname: Park, Seolhye
  email: druyvesteyndf@gmail.com
  organization: Samsung Display Co., Ltd
– sequence: 2
  givenname: Yunyoung
  surname: Kyung
  fullname: Kyung, Yunyoung
  organization: Samsung Display Co., Ltd
– sequence: 3
  givenname: Juyoung
  surname: Lee
  fullname: Lee, Juyoung
  organization: Samsung Display Co., Ltd
– sequence: 4
  givenname: Yongsuk
  surname: Jang
  fullname: Jang, Yongsuk
  organization: Samsung Display Co., Ltd
– sequence: 5
  givenname: Taewon
  surname: Cha
  fullname: Cha, Taewon
  organization: Samsung Display Co., Ltd
– sequence: 6
  givenname: Yeongil
  surname: Noh
  fullname: Noh, Yeongil
  organization: Samsung Display Co., Ltd
– sequence: 7
  givenname: Younghoon
  surname: Choi
  fullname: Choi, Younghoon
  organization: Samsung Display Co., Ltd
– sequence: 8
  givenname: Byungsoo
  surname: Kim
  fullname: Kim, Byungsoo
  organization: Samsung Display Co., Ltd
– sequence: 9
  givenname: Taeyoung
  surname: Cho
  fullname: Cho, Taeyoung
  organization: Samsung Display Co., Ltd
– sequence: 10
  givenname: Rabul
  surname: Seo
  fullname: Seo, Rabul
  organization: Samsung Display Co., Ltd
– sequence: 11
  givenname: Jae‐Ho
  surname: Yang
  fullname: Yang, Jae‐Ho
  organization: Samsung Display Co., Ltd
– sequence: 12
  givenname: Yunchang
  surname: Jang
  fullname: Jang, Yunchang
  organization: Seoul National University
– sequence: 13
  givenname: Sangwon
  surname: Ryu
  fullname: Ryu, Sangwon
  organization: Seoul National University
– sequence: 14
  givenname: Gon‐Ho
  surname: Kim
  fullname: Kim, Gon‐Ho
  organization: Seoul National University
BookMark eNqFkF1LwzAUhoNM8PPW64DXmydpVpPLMacOJhui3pY0PXGRrq1Ji_TOn-Bv9JfYMpkgiFc5hOc5H-8RGRRlgYScMRgxAH5RVboacWAKACLYI4csZnwoZawGu3oMB-QohJeeGEs4JNVUNwGpLnTeBhdoaWm9Rmp1k9eBuoLeTu6nFGuzdsUzrXxpMAQMNG1pE_qvnl7NP98_nu7opswwp7b0dLmYXdHMhSrXLd3oorHa1I3vhBOyb3Ue8PT7PSaP17OH6e1wsbyZTyeLoREcYKiVkRbQpEKlGiwiylRoYY1MUwaKxZapmGMc6YiNxxwwRSVExlFkGVjLomNyvu3b7fzaYKiTl7Lx3Zkh4VwKeRnJSHXUaEsZX4bg0SaVdxvt24RB0qea9Kkmu1Q7QfwSjKt17cqi9trlf2tqq725HNt_hiSr1WT1434B0oKQbQ
CitedBy_id crossref_primary_10_1063_5_0261778
crossref_primary_10_1002_ppap_201990001
crossref_primary_10_1063_5_0202363
crossref_primary_10_1109_TPS_2023_3268170
crossref_primary_10_3390_ma14113005
crossref_primary_10_1088_1361_6587_ad1ae5
Cites_doi 10.1051/rphysap:01985002008060900
10.1116/1.582053
10.1016/j.surfcoat.2011.09.070
10.7567/JJAP.56.066502
10.1088/0963-0252/14/3/025
10.1016/j.tsf.2016.01.051
10.1088/0963-0252/11/4/320
10.1143/JJAP.39.1583
10.1143/JJAP.39.4666
10.1109/TSM.2015.2432576
10.1109/27.467995
10.1088/0022-3727/21/12/011
10.1116/1.1697483
10.1088/0963-0252/10/1/310
10.1002/0471724254
10.1088/0963-0252/17/4/045003
10.1143/JJAP.26.1170
10.1149/1.1394055
10.1088/1361-6587/aae2db
10.1002/aic.14053
10.1088/1361-6463/aa76f5
10.1063/1.3043843
10.3938/jkps.64.1819
10.1613/jair.953
ContentType Journal Article
Copyright 2019 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim
Copyright_xml – notice: 2019 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim
DBID AAYXX
CITATION
7SR
8FD
JG9
DOI 10.1002/ppap.201900030
DatabaseName CrossRef
Engineered Materials Abstracts
Technology Research Database
Materials Research Database
DatabaseTitle CrossRef
Materials Research Database
Technology Research Database
Engineered Materials Abstracts
DatabaseTitleList CrossRef
Materials Research Database

DeliveryMethod fulltext_linktorsrc
Discipline Chemistry
EISSN 1612-8869
EndPage n/a
ExternalDocumentID 10_1002_ppap_201900030
PPAP201900030
Genre article
GroupedDBID .3N
.GA
.Y3
05W
0R~
10A
123
1L6
1OC
31~
33P
3SF
3WU
4.4
50Y
50Z
51W
51X
52M
52N
52O
52P
52S
52T
52U
52W
52X
5VS
66C
702
7PT
8-0
8-1
8-3
8-4
8-5
8UM
930
A03
AAESR
AAEVG
AAHHS
AAHQN
AAMNL
AANHP
AANLZ
AAONW
AASGY
AAXRX
AAYCA
AAZKR
ABCQN
ABCUV
ABEML
ABIJN
ABPVW
ACAHQ
ACBWZ
ACCFJ
ACCZN
ACGFS
ACIWK
ACPOU
ACRPL
ACSCC
ACXBN
ACXQS
ACYXJ
ADBBV
ADEOM
ADIZJ
ADKYN
ADMGS
ADNMO
ADOZA
ADXAS
ADZMN
AEEZP
AEIGN
AEIMD
AENEX
AEQDE
AEUQT
AEUYR
AFBPY
AFFPM
AFGKR
AFPWT
AFWVQ
AFZJQ
AHBTC
AITYG
AIURR
AIWBW
AJBDE
AJXKR
ALAGY
ALMA_UNASSIGNED_HOLDINGS
ALUQN
ALVPJ
AMBMR
AMYDB
ASPBG
ATUGU
AUFTA
AVWKF
AZBYB
AZFZN
AZVAB
BAFTC
BDRZF
BFHJK
BHBCM
BMNLL
BMXJE
BNHUX
BROTX
BRXPI
BY8
CS3
D-E
D-F
DCZOG
DPXWK
DR2
DRFUL
DRSTM
DU5
EBS
EJD
F00
F01
F04
F5P
FEDTE
G-S
G.N
GODZA
H.T
H.X
HBH
HF~
HGLYW
HVGLF
HZ~
IX1
J0M
JPC
KQQ
LATKE
LAW
LC2
LC3
LEEKS
LH4
LITHE
LOXES
LP6
LP7
LUTES
LW6
LYRES
MEWTI
MK4
MRFUL
MRSTM
MSFUL
MSSTM
MXFUL
MXSTM
N04
N05
N9A
NF~
O66
O9-
OIG
P2P
P2W
P2X
P4D
Q.N
Q11
QB0
QRW
R.K
ROL
RWI
RX1
SUPJJ
UB1
W8V
W99
WBKPD
WFSAM
WIH
WIK
WOHZO
WQJ
WRC
WXSBR
WYISQ
XG1
XV2
ZZTAW
~IA
~WT
AAMMB
AAYXX
AEFGJ
AEYWJ
AGHNM
AGQPQ
AGXDD
AGYGG
AIDQK
AIDYY
CITATION
O8X
7SR
8FD
JG9
ID FETCH-LOGICAL-c4200-a9c8f0ecb49ba0feee8b4a4fc8bb10916f1962e63a315520ebe944d2e4dd0ff13
IEDL.DBID DRFUL
ISICitedReferencesCount 7
ISICitedReferencesURI http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=000486091500014&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
ISSN 1612-8850
IngestDate Fri Jul 25 10:44:41 EDT 2025
Sat Nov 29 02:40:16 EST 2025
Tue Nov 18 22:25:48 EST 2025
Wed Jan 22 16:39:56 EST 2025
IsPeerReviewed true
IsScholarly true
Issue 9
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c4200-a9c8f0ecb49ba0feee8b4a4fc8bb10916f1962e63a315520ebe944d2e4dd0ff13
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0002-5957-1532
PQID 2284873839
PQPubID 1036335
PageCount 13
ParticipantIDs proquest_journals_2284873839
crossref_primary_10_1002_ppap_201900030
crossref_citationtrail_10_1002_ppap_201900030
wiley_primary_10_1002_ppap_201900030_PPAP201900030
PublicationCentury 2000
PublicationDate September 2019
PublicationDateYYYYMMDD 2019-09-01
PublicationDate_xml – month: 09
  year: 2019
  text: September 2019
PublicationDecade 2010
PublicationPlace Weinheim
PublicationPlace_xml – name: Weinheim
PublicationTitle Plasma processes and polymers
PublicationYear 2019
Publisher Wiley Subscription Services, Inc
Publisher_xml – name: Wiley Subscription Services, Inc
References e_1_2_7_1_10_1
e_1_2_7_1_21_1
e_1_2_7_1_11_1
e_1_2_7_1_22_1
e_1_2_7_1_12_1
e_1_2_7_1_23_1
e_1_2_7_1_13_1
e_1_2_7_1_24_1
e_1_2_7_1_9_1
e_1_2_7_1_20_1
e_1_2_7_1_5_1
e_1_2_7_1_18_1
e_1_2_7_1_6_1
e_1_2_7_1_19_1
e_1_2_7_1_7_1
e_1_2_7_1_8_1
e_1_2_7_1_14_1
e_1_2_7_1_25_1
e_1_2_7_1_2_1
e_1_2_7_1_15_1
e_1_2_7_1_3_1
e_1_2_7_1_16_1
e_1_2_7_1_4_1
e_1_2_7_1_17_1
References_xml – ident: e_1_2_7_1_2_1
  doi: 10.1051/rphysap:01985002008060900
– ident: e_1_2_7_1_4_1
  doi: 10.1116/1.582053
– ident: e_1_2_7_1_21_1
  doi: 10.1016/j.surfcoat.2011.09.070
– ident: e_1_2_7_1_5_1
  doi: 10.7567/JJAP.56.066502
– ident: e_1_2_7_1_22_1
  doi: 10.1088/0963-0252/14/3/025
– ident: e_1_2_7_1_9_1
  doi: 10.1016/j.tsf.2016.01.051
– ident: e_1_2_7_1_14_1
  doi: 10.1088/0963-0252/11/4/320
– ident: e_1_2_7_1_16_1
  doi: 10.1143/JJAP.39.1583
– ident: e_1_2_7_1_3_1
  doi: 10.1143/JJAP.39.4666
– ident: e_1_2_7_1_10_1
  doi: 10.1109/TSM.2015.2432576
– ident: e_1_2_7_1_12_1
  doi: 10.1109/27.467995
– ident: e_1_2_7_1_17_1
  doi: 10.1088/0022-3727/21/12/011
– ident: e_1_2_7_1_20_1
  doi: 10.1116/1.1697483
– ident: e_1_2_7_1_6_1
  doi: 10.1088/0963-0252/10/1/310
– ident: e_1_2_7_1_13_1
  doi: 10.1002/0471724254
– ident: e_1_2_7_1_23_1
  doi: 10.1088/0963-0252/17/4/045003
– ident: e_1_2_7_1_18_1
  doi: 10.1143/JJAP.26.1170
– ident: e_1_2_7_1_8_1
  doi: 10.1149/1.1394055
– ident: e_1_2_7_1_11_1
  doi: 10.1088/1361-6587/aae2db
– ident: e_1_2_7_1_15_1
  doi: 10.1002/aic.14053
– ident: e_1_2_7_1_19_1
  doi: 10.1088/1361-6463/aa76f5
– ident: e_1_2_7_1_25_1
  doi: 10.1063/1.3043843
– ident: e_1_2_7_1_7_1
  doi: 10.3938/jkps.64.1819
– ident: e_1_2_7_1_24_1
  doi: 10.1613/jair.953
SSID ssj0030580
Score 2.2536695
Snippet High‐aspect ratio contact (HARC) etching is a bottleneck step of the high‐definition organic light emitting diode (OLED) display manufacturing processes. HARC...
SourceID proquest
crossref
wiley
SourceType Aggregation Database
Enrichment Source
Index Database
Publisher
SubjectTerms Algorithms
Aspect ratio
cause analysis
dry etch
Etching
fault prediction
Ion flux
Manufacturing
Mass production
Optical emission spectroscopy
Organic light emitting diodes
plasma information
virtual metrology
Title Cause analysis of the faults in HARC etching processes by using the PI‐VM model for OLED display manufacturing
URI https://onlinelibrary.wiley.com/doi/abs/10.1002%2Fppap.201900030
https://www.proquest.com/docview/2284873839
Volume 16
WOSCitedRecordID wos000486091500014&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVWIB
  databaseName: Wiley Online Library Full Collection 2020
  customDbUrl:
  eissn: 1612-8869
  dateEnd: 99991231
  omitProxy: false
  ssIdentifier: ssj0030580
  issn: 1612-8850
  databaseCode: DRFUL
  dateStart: 20040101
  isFulltext: true
  titleUrlDefault: https://onlinelibrary.wiley.com
  providerName: Wiley-Blackwell
link http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV1LS8NAEF60FfTiW6wv5iB4Cibppt0cSx9U8BHEirewu9mVQk1D0wq9-RP8jf4SZ_Oo9SCC3hKYXcLOfDvfhp1vCDlviojRyHEsD49eFnUotxj3mxbmHqQTvqs9O2820by9ZU9PfrBUxZ_rQyx-uBlkZPu1ATgX6eWXaGiScKM36fgZrV8lVVNZhXFd7dz3BtflbozhnHVPQ2KDyGeeXQo32u7l9xm-J6YvtrnMWbOk09v6_-duk82CcEIrj5AdsqLiXbLeLvu87ZGkzWepAl6ok8BYA5JC0Hw2mqYwjKHfum-D8S5mOUjywgKVgpiDuTT_nFkHVx9v7483kDXWASTCcHfd7UA0TJMRn8MLj2emhCKridwng173od23ij4MlqQIIov7kmlbSUF9wW2tlGKCcqolE8LoijY0wthVjTqvG0E3G-PCpzRyFY0iW2unfkAq8ThWhwQoshE8U0raQBNlhHWY9KTwPC9qUKmcGrFKJ4SyECk3vTJGYS6v7IZmHcPFOtbIxcI-yeU5frQ8KX0aFjBNQxeTM2viId2vETfz3i-zhEHQChZvR38ZdEw2zHN-T-2EVKaTmTola_J1OkwnZ0X4fgK5su_f
linkProvider Wiley-Blackwell
linkToHtml http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwrV1LS8NAEB60CnrxLdbnHARPwSTdtJtjqZaKtQZR8RY2m10p1BhMK3jzJ_gb_SXO5lH1IIJ4TJgsYWdm55tl5huAw1YUcxY7juVR6mUxhwmLC79lUewhOOG72rOLYROtwYDf3flBWU1oemEKfojphZvxjPy8Ng5uLqSPP1lD01QYwknHz3H9LMwxsiW7BnMnV92bfnUckz3n49MI2ZDrc8-umBtt9_j7Ct8j0yfc_Apa86jTXf6H_12BpRJyYruwkVWYUckaLHSqSW_rkHbEJFMoSn4SfNRIsBC1mIzGGQ4T7LWvOmj0S3EO06K1QGUYvaApm7_PpYOz99e32wvMR-sgQWG87J-eYDzM0pF4wQeRTEwTRd4VuQE33dPrTs8qJzFYkpEbWcKXXNtKRsyPhK2VUjxigmnJo8gwizY1ObKrmg3RMJRuNlmGz1jsKhbHttZOYxNqyWOitgAZ4RHKKiVrkogy1DpcejLyPC9uMqmcOliVFkJZ0pSbaRmjsCBYdkOzj-F0H-twNJVPC4KOHyV3K6WGpaNmoUvhmbcoTffr4Obq-2WVMAjawfRp-y8fHcBC7_qiH_bPBuc7sGjeF1Vru1AbP03UHszL5_Ewe9ovbfkDCDfzxg
linkToPdf http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwrV3NTttAEB6VgCgXyk8rUijMAYmThe2sk_UxSoiCGlIrKoibtV7vokipY8UJUm48Qp-xT9JZ_yTkgCpVHG3NrqydmZ1vrJlvAC5bUcxZ7DiWR6mXxRwmLC78lkWxh-CE72rPLoZNtIZD_vjoB2U1oemFKfghVj_cjGfk97VxcJXG-nrNGpqmwhBOOn6O67dgm3kE9muw3R317gfVdUz2nI9PI2RDrs89u2JutN3rzR02I9Mabr4GrXnU6X16h-89gP0ScmK7sJFD-KCSI_jYqSa9HUPaEYtMoSj5SXCqkWAharGYzDMcJ9hvjzpo9EtxDtOitUBlGC3RlM0_5dLB7Z-X3w93mI_WQYLC-GNw08V4nKUTscRfIlmYJoq8K_Iz3Pdufnb6VjmJwZKM3MgSvuTaVjJifiRsrZTiERNMSx5Fhlm0qcmRXdVsiIahdLPJMnzGYlexOLa1dhpfoJZME3UCyAiPUFYpWZNElKHW4dKTked5cZNJ5dTBqrQQypKm3EzLmIQFwbIbmnMMV-dYh6uVfFoQdLwpeVYpNSwdNQtdCs-8RWm6Xwc3V98_dgmDoB2snr7-z6IL2A26vXBwO_x-CnvmdVG0dga1-WyhvsGOfJ6Ps9l5acp_Abz880o
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Cause+analysis+of+the+faults+in+HARC+etching+processes+by+using+the+PI%E2%80%90VM+model+for+OLED+display+manufacturing&rft.jtitle=Plasma+processes+and+polymers&rft.au=Park%2C+Seolhye&rft.au=Yunyoung+Kyung&rft.au=Lee%2C+Juyoung&rft.au=Jang%2C+Yongsuk&rft.date=2019-09-01&rft.pub=Wiley+Subscription+Services%2C+Inc&rft.issn=1612-8850&rft.eissn=1612-8869&rft.volume=16&rft.issue=9&rft_id=info:doi/10.1002%2Fppap.201900030&rft.externalDBID=NO_FULL_TEXT
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1612-8850&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1612-8850&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1612-8850&client=summon