Enhanced thermal conductivities of epoxy nanocomposites via incorporating in-situ fabricated hetero-structured SiC-BNNS fillers
Novel hetero-structured silicon carbide-boron nitride nanosheets (SiC-BNNS) by sol-gel and in-situ growth method were performed as thermally conductive & insulating fillers, and the SiC-BNNS/epoxy thermally conductive nanocomposites were then prepared by blending-casting approach. Synthesized he...
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| Published in: | Composites science and technology Vol. 187; p. 107944 |
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| Main Authors: | , , , , , , |
| Format: | Journal Article |
| Language: | English |
| Published: |
Barking
Elsevier Ltd
08.02.2020
Elsevier BV |
| Subjects: | |
| ISSN: | 0266-3538, 1879-1050 |
| Online Access: | Get full text |
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| Summary: | Novel hetero-structured silicon carbide-boron nitride nanosheets (SiC-BNNS) by sol-gel and in-situ growth method were performed as thermally conductive & insulating fillers, and the SiC-BNNS/epoxy thermally conductive nanocomposites were then prepared by blending-casting approach. Synthesized hetero-structured SiC-BNNS fillers have synergistic improvement effects on the thermal conductivities of the SiC-BNNS/epoxy nanocomposites. When the amount of hetero-structured SiC-BNNS fillers is 20 wt% (SiC-BNNS, 1/1, w/w), the thermal conductivity coefficient (λ) value of the SiC-BNNS/epoxy nanocomposites (0.89 W/mK) is 4.1 times that of pure epoxy resin (0.22 W/mK), and 2.1, 1.4, and 1.7 times of SiC/epoxy (0.43 W/mK), BNNS/epoxy (0.62 W/mK), and (SiC/BNNS)/epoxy thermally conductive nanocomposites (0.52 W/mK) with the same amount of fillers (20 wt% single BNNS, SiC, or SiC/BNNS hybrid fillers), respectively. Meantime, the obtained (SiC-BNNS)/epoxy thermally conductive nanocomposites also demonstrate favorable electrical insulating properties, and the breakdown strength, volume resistivity as well as surface resistivity is 22.1 kV/mm, 2.32 × 1015 Ω cm, and 1.26 × 1015 Ω cm, respectively. |
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| Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 |
| ISSN: | 0266-3538 1879-1050 |
| DOI: | 10.1016/j.compscitech.2019.107944 |