A wet dismantling process for the recycling of computer printed circuit boards

•A new process for dismantling the components on printed circuit boards was studied.•Process was assessed by visual analysis of components degradation.•Process was assessed by solutions characterization.•Recovery of aluminium and tin in WPCBs was achieved. In this research a new process for dismantl...

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Vydáno v:Resources, conservation and recycling Ročník 132; s. 71 - 76
Hlavní autoři: Pinho, Sílvia, Ferreira, Marco, Almeida, Manuel F.
Médium: Journal Article
Jazyk:angličtina
Vydáno: Elsevier B.V 01.05.2018
Témata:
Alkaline wet dismantling
aluminum
aqueous solutions
computers
copper
Electronic wastes
epoxides
glass fibers
iron
lead
pollution
Printed circuit boards
recycling
sodium hydroxide
tin
zinc
Electronic wastes
Alkaline wet dismantling
Printed circuit boards
ISSN:0921-3449, 1879-0658
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Shrnutí:•A new process for dismantling the components on printed circuit boards was studied.•Process was assessed by visual analysis of components degradation.•Process was assessed by solutions characterization.•Recovery of aluminium and tin in WPCBs was achieved. In this research a new process for dismantling the components of the waste printed circuit boards (WPCBs) was developed. This process uses water and aqueous solutions of sodium hydroxide at conditions above solder melting temperatures which not only prevents pollution problems, but also separates the multilayers of WPCBs. The results show that removal of components in the WPCBs was achieved at 280 °C for 15 min with a 1 M NaOH solution. At these conditions glass fiber, epoxy resin and copper layers were separated and the resultant solution showed low concentration of copper, zinc, lead and iron ranging from 23 to 43 mg/kg of WPCBs and high concentration of tin and aluminium of 8 g/kg and 61 g/kg of WPCBs, respectively. About 97% of tin and 99% of aluminium in this solution were removed by precipitation.
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ISSN:0921-3449
1879-0658
DOI:10.1016/j.resconrec.2018.01.022