A wet dismantling process for the recycling of computer printed circuit boards
•A new process for dismantling the components on printed circuit boards was studied.•Process was assessed by visual analysis of components degradation.•Process was assessed by solutions characterization.•Recovery of aluminium and tin in WPCBs was achieved. In this research a new process for dismantl...
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| Veröffentlicht in: | Resources, conservation and recycling Jg. 132; S. 71 - 76 |
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| Hauptverfasser: | , , |
| Format: | Journal Article |
| Sprache: | Englisch |
| Veröffentlicht: |
Elsevier B.V
01.05.2018
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| Schlagworte: | |
| ISSN: | 0921-3449, 1879-0658 |
| Online-Zugang: | Volltext |
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