Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

Thermoelectric modules experience performance reduction and mechanical failure due to thermomechanical stresses induced by thermal cycling. The present study subjects a thermoelectric module to thermal cycling and evaluates the evolution of its thermoelectric performance through measurements of the...

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Veröffentlicht in:	Journal of electronic materials Jg. 42; H. 3; S. 372 - 381
Hauptverfasser:	Barako, M. T., Park, W., Marconnet, A. M., Asheghi, M., Goodson, K. E.
Format:	Journal Article
Sprache:	Englisch
Veröffentlicht:	Boston Springer US 01.03.2013 Springer Springer Nature B.V
Schlagworte:	Applied sciences Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: electronic structure, electrical, magnetic, and optical properties Conductivity phenomena in semiconductors and insulators Electronic transport in condensed matter Electronics Electronics and Microelectronics Exact sciences and technology Heat conductivity Instrumentation Materials Materials Science Mechanical properties Optical and Electronic Materials Physics Scanning electron microscopy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solid State Physics Thermal cycling Thermoelectric and thermomagnetic effects Thermoelectric, pyroelectric devices, etc Thermography Harman method Thermoelectric module figure of merit infrared microscopy thermal cycling Scanning electron microscopy Electrical conductivity Thermal cycle Seebeck effect Steady state Thermoelectric properties Thermoelectric device Thermoelectric power Thermal conductivity Defect Figure of merit Thermomechanical stress Thermal degradation
ISSN:	0361-5235, 1543-186X
Online-Zugang:	Volltext
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