Jiang, D., Lin, W., & Raghavan, N. (2021). Semiconductor Manufacturing Final Test Yield Optimization and Wafer Acceptance Test Parameter Inverse Design Using Multi-Objective Optimization Algorithms. IEEE access, 9, 137655-137666. https://doi.org/10.1109/ACCESS.2021.3117576
Chicago-Zitierstil (17. Ausg.)Jiang, Dan, Weihua Lin, und Nagarajan Raghavan. "Semiconductor Manufacturing Final Test Yield Optimization and Wafer Acceptance Test Parameter Inverse Design Using Multi-Objective Optimization Algorithms." IEEE Access 9 (2021): 137655-137666. https://doi.org/10.1109/ACCESS.2021.3117576.
MLA-Zitierstil (9. Ausg.)Jiang, Dan, et al. "Semiconductor Manufacturing Final Test Yield Optimization and Wafer Acceptance Test Parameter Inverse Design Using Multi-Objective Optimization Algorithms." IEEE Access, vol. 9, 2021, pp. 137655-137666, https://doi.org/10.1109/ACCESS.2021.3117576.