Cold sintering of microwave dielectric ceramics and devices

Microwave (MW) dielectric ceramics are used in numerous electronic components for modern wireless communication systems, including antennas, resonators, capacitors and filters. However, to date, MW ceramics are manufactured by an energy-intensive, conventional high-temperature (> 1000 °C) sinteri...

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Veröffentlicht in:Journal of materials research Jg. 36; H. 2; S. 333 - 349
Hauptverfasser: Wang, Dawei, Li, Linhao, Jiang, Juan, Lu, Zhilun, Wang, Ge, Song, Kaixin, Zhou, Di, Reaney, Ian M.
Format: Journal Article
Sprache:Englisch
Veröffentlicht: Cham Springer International Publishing 01.01.2021
Springer Nature B.V
Schlagworte:
Applied and Technical Physics
Biomaterials
Ceramics
Chemistry and Materials Science
Cold
Cold pressing
Cold sintering
Crystal structure
Dissimilar materials
Electrodes
Electrolytes
Electronic components
External pressure
High temperature
Hot pressing
Inorganic Chemistry
Invited Feature Paper-Review
Liquid phases
Materials Engineering
Materials research
Materials Science
Mechanical properties
Melting points
Nanotechnology
Sintering
Temperature
Wireless communication systems
ISSN:0884-2914, 2044-5326
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Zusammenfassung:Microwave (MW) dielectric ceramics are used in numerous electronic components for modern wireless communication systems, including antennas, resonators, capacitors and filters. However, to date, MW ceramics are manufactured by an energy-intensive, conventional high-temperature (> 1000 °C) sintering technology and thus cannot be co-sintered with low melting point and base electrodes (Ag, Al, etc., < 1000 °C), nor directly integrated with polymers (< 200 °C). Cold sintering is able to densify ceramics at < 200 °C via a combination of external pressure and a transient liquid phase, reducing the energy consumed and facilitating greater integration with dissimilar materials. This review outlines the basics of MW ceramics alongside the mechanism of cold sintering. Recent developments in cold sintering of MW ceramics, composites and devices are described, emphasizing new materials and progress towards component/device fabrication. Future prospects and critical issues for advancing cold-sintered MW materials and devices, such as unclear mechanism, low Q  ×  f values and poor mechanical properties, are discussed. Graphic abstract
Bibliographie:ObjectType-Article-1
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ISSN:0884-2914
2044-5326
DOI:10.1557/s43578-020-00029-w