A dynamic scheduling algorithm for singe-arm two-cluster tools with flexible processing times

This article presents a dynamic algorithm for job scheduling in two-cluster tools producing multi-type wafers with flexible processing times. Flexible processing times mean that the actual times for processing wafers should be within given time intervals. The objective of the work is to minimize the...

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Bibliographic Details
Published in:Engineering optimization Vol. 50; no. 2; pp. 329 - 346
Main Authors: Li, Xin, Fung, Richard Y. K.
Format: Journal Article
Language:English
Published: Abingdon Taylor & Francis 01.02.2018
Taylor & Francis Ltd
Subjects:
Clusters
Completion time
Decomposition
decomposition method
dynamic scheduling
Production scheduling
residency time constraints
Scheduling algorithms
temporal time set
Two-cluster tools
Wafers
ISSN:0305-215X, 1029-0273
Online Access:Get full text
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Summary:This article presents a dynamic algorithm for job scheduling in two-cluster tools producing multi-type wafers with flexible processing times. Flexible processing times mean that the actual times for processing wafers should be within given time intervals. The objective of the work is to minimize the completion time of the newly inserted wafer. To deal with this issue, a two-cluster tool is decomposed into three reduced single-cluster tools (RCTs) in a series based on a decomposition approach proposed in this article. For each single-cluster tool, a dynamic scheduling algorithm based on temporal constraints is developed to schedule the newly inserted wafer. Three experiments have been carried out to test the dynamic scheduling algorithm proposed, comparing with the results the 'earliest starting time' heuristic (EST) adopted in previous literature. The results show that the dynamic algorithm proposed in this article is effective and practical.
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ISSN:0305-215X
1029-0273
DOI:10.1080/0305215X.2017.1310209