Epoxy curing in mild and eco-friendly conditions: Towards bisphenol A-free systems

Epoxy resins rank among the most significantly used thermosets, showing high thermal and mechanical properties. Unfortunately, current polymerization processes to reach these properties are energy-intensive, characterized by high temperatures and long processing duration. Addressing this problem, re...

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Bibliographic Details
Published in:	Progress in polymer science Vol. 157; p. 101873
Main Authors:	Lavaux, Valentine, Lalevée, Jacques
Format:	Journal Article
Language:	English
Published:	Elsevier Ltd 01.10.2024
Subjects:	Bio-based materials Epoxy Mild conditions Photopolymerization Polyadditions Redox polymerization RT PS Redox polymerization DEGA Epoxy PU ELO CHO DGEVA RICFP Tg Photopolymerization LDO Mild conditions TMPTMP DMPA PHU CA EC CC DGFA CE DPSi PTKMP LED TTMSS LCA ECO DETA BPA FER Polyadditions NIR ECHA PI TPED GPE DGEBA Bio-based materials EVO
ISSN:	0079-6700
Online Access:	Get full text
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