APA-Zitierstil (7. Ausg.)

Tu, K. (2011). Reliability challenges in 3D IC packaging technology. Microelectronics and reliability, 51(3), 517-523. https://doi.org/10.1016/j.microrel.2010.09.031

Chicago-Zitierstil (17. Ausg.)

Tu, K.N. "Reliability Challenges in 3D IC Packaging Technology." Microelectronics and Reliability 51, no. 3 (2011): 517-523. https://doi.org/10.1016/j.microrel.2010.09.031.

MLA-Zitierstil (9. Ausg.)

Tu, K.N. "Reliability Challenges in 3D IC Packaging Technology." Microelectronics and Reliability, vol. 51, no. 3, 2011, pp. 517-523, https://doi.org/10.1016/j.microrel.2010.09.031.