Ma, J., Liu, H., Yang, N., Zou, J., Lin, S., Zhang, Y., . . . Wang, H. (2022). Circuit‐Level Memory Technologies and Applications based on 2D Materials. Advanced materials (Weinheim), 34(48), e2202371-n/a. https://doi.org/10.1002/adma.202202371
Chicago Style (17th ed.) CitationMa, Jiahui, Hefei Liu, Ning Yang, Jingyi Zou, Sen Lin, Yuhao Zhang, Xu Zhang, Jing Guo, and Han Wang. "Circuit‐Level Memory Technologies and Applications Based on 2D Materials." Advanced Materials (Weinheim) 34, no. 48 (2022): e2202371-n/a. https://doi.org/10.1002/adma.202202371.
MLA (9th ed.) CitationMa, Jiahui, et al. "Circuit‐Level Memory Technologies and Applications Based on 2D Materials." Advanced Materials (Weinheim), vol. 34, no. 48, 2022, pp. e2202371-n/a, https://doi.org/10.1002/adma.202202371.