APA (7th ed.) Citation

Vivet, P., Guthmuller, E., Thonnart, Y., Pillonnet, G., Fuguet, C., Miro-Panades, I., . . . Clermidy, F. (2021). IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE journal of solid-state circuits, 56(1), 79-97. https://doi.org/10.1109/JSSC.2020.3036341

Chicago Style (17th ed.) Citation

Vivet, Pascal, et al. "IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management." IEEE Journal of Solid-state Circuits 56, no. 1 (2021): 79-97. https://doi.org/10.1109/JSSC.2020.3036341.

MLA (9th ed.) Citation

Vivet, Pascal, et al. "IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management." IEEE Journal of Solid-state Circuits, vol. 56, no. 1, 2021, pp. 79-97, https://doi.org/10.1109/JSSC.2020.3036341.