Using intelligent technology and real-time feedback algorithm to improve manufacturing process in IoT semiconductor industry
To enable the Internet of things, the semiconductor manufacturing process has progressed from the micron to the deep submicron level. Quality improvement is one of the great challenges in wafer fabrication. Computer-integrated manufacturing (CIM) has arisen as a means by which to reduce wafer rework...
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| Published in: | The Journal of supercomputing Vol. 77; no. 5; pp. 4639 - 4658 |
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| Main Authors: | , , |
| Format: | Journal Article |
| Language: | English |
| Published: |
New York
Springer US
01.05.2021
Springer Nature B.V |
| Subjects: | |
| ISSN: | 0920-8542, 1573-0484 |
| Online Access: | Get full text |
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