Using intelligent technology and real-time feedback algorithm to improve manufacturing process in IoT semiconductor industry

To enable the Internet of things, the semiconductor manufacturing process has progressed from the micron to the deep submicron level. Quality improvement is one of the great challenges in wafer fabrication. Computer-integrated manufacturing (CIM) has arisen as a means by which to reduce wafer rework...

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Bibliographic Details
Published in:The Journal of supercomputing Vol. 77; no. 5; pp. 4639 - 4658
Main Authors: Li, Bin, Chen, Ruey-Shun, Liu, C.-Y.
Format: Journal Article
Language:English
Published: New York Springer US 01.05.2021
Springer Nature B.V
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ISSN:0920-8542, 1573-0484
Online Access:Get full text
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