Modeling of Mutual Coupling Between Planar Inductors in Wireless Power Applications

This paper presents a compact model of mutual inductance between two planar inductors, which is essential to design and optimize a wireless power transmission system. The tracks of the planar inductors are modeled as constant current carrying filaments, and the mutual inductance between individual f...

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Vydáno v:IEEE transactions on power electronics Ročník 29; číslo 1; s. 481 - 490
Hlavní autoři: Raju, Salahuddin, Rongxiang Wu, Mansun Chan, Yue, C. Patrick
Médium: Journal Article
Jazyk:angličtina
Vydáno: New York, NY IEEE 01.01.2014
Institute of Electrical and Electronics Engineers
Témata:
Applied sciences
Coils
Contactless power transfer
Electrical engineering. Electrical power engineering
Electrical power engineering
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
implantable biomedical devices
Inductance
inductive wireless power link
Inductors
Magnetic devices
Mathematical model
mutual inductance
planar inductor
Power networks and lines
Predictive models
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solid modeling
Transformers and inductors
Users connections and in door installation
Wireless communication
Mutual coupling
Electromagnetism
Electric energy transportation
Wireless telecommunication
Printed circuit board
Compact design
Wireless electricity
Battery charging
Mutual inductance
Inductor
Modeling
planar inductor
inductive wireless power link
implantable biomedical devices
Series expansion
Numerical simulation
Silicon
Printed circuit
Comparative study
Wafer
Power transmission line
Planar technology
Contactless power transfer
ISSN:0885-8993, 1941-0107
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Popis
Shrnutí:This paper presents a compact model of mutual inductance between two planar inductors, which is essential to design and optimize a wireless power transmission system. The tracks of the planar inductors are modeled as constant current carrying filaments, and the mutual inductance between individual filaments is determined by Neumann's integral. The proposed model is derived by solving Neumann's integral using a series expansion technique. This model can predict the mutual inductance at various axial and lateral displacements. Mutual coupling between planar inductors is computed by a 3-D electromagnetic (EM) solver, and the proposed model shows good agreement with these numerical results. Different types of planar inductors were fabricated on a printed circuit board (PCB) or silicon wafer. Using these inductors, wireless power links were constructed for applications like implantable biomedical devices and contactless battery charging systems. Mutual inductance was measured for each of the cases, and the comparison shows that the proposed model can predict mutual coupling suitably.
ISSN:0885-8993
1941-0107
DOI:10.1109/TPEL.2013.2253334