Raju, S., Wu, R., Chan, M., & Yue, C. P. (2014). Modeling of Mutual Coupling Between Planar Inductors in Wireless Power Applications. IEEE transactions on power electronics, 29(1), 481-490. https://doi.org/10.1109/TPEL.2013.2253334
Chicago Style (17th ed.) CitationRaju, Salahuddin, Rongxiang Wu, Mansun Chan, and C. Patrick Yue. "Modeling of Mutual Coupling Between Planar Inductors in Wireless Power Applications." IEEE Transactions on Power Electronics 29, no. 1 (2014): 481-490. https://doi.org/10.1109/TPEL.2013.2253334.
MLA (9th ed.) CitationRaju, Salahuddin, et al. "Modeling of Mutual Coupling Between Planar Inductors in Wireless Power Applications." IEEE Transactions on Power Electronics, vol. 29, no. 1, 2014, pp. 481-490, https://doi.org/10.1109/TPEL.2013.2253334.