Park, S., & Park, D. (2024). Low-Power Scalable TSPI: A Modular Off-Chip Network for Edge AI Accelerators. IEEE access, 12, 141448-141459. https://doi.org/10.1109/ACCESS.2024.3466965
Citácia podle Chicago (17th ed.)Park, Seunghyun, a Daejin Park. "Low-Power Scalable TSPI: A Modular Off-Chip Network for Edge AI Accelerators." IEEE Access 12 (2024): 141448-141459. https://doi.org/10.1109/ACCESS.2024.3466965.
Citácia podľa MLA (8th ed.)Park, Seunghyun, a Daejin Park. "Low-Power Scalable TSPI: A Modular Off-Chip Network for Edge AI Accelerators." IEEE Access, vol. 12, 2024, pp. 141448-141459, https://doi.org/10.1109/ACCESS.2024.3466965.
Upozornenie: Tieto citáce sú generované automaticky. Nemusia byť úplne správne podľa citačných pravidiel..