From Artificial Intelligence to Explainable Artificial Intelligence in Industry 4.0: A Survey on What, How, and Where

Nowadays, Industry 4.0 can be considered a reality, a paradigm integrating modern technologies and innovations. Artificial intelligence (AI) can be considered the leading component of the industrial transformation enabling intelligent machines to execute tasks autonomously such as self-monitoring, i...

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Vydáno v:	IEEE transactions on industrial informatics Ročník 18; číslo 8; s. 5031 - 5042
Hlavní autoři:	Ahmed, Imran, Jeon, Gwanggil, Piccialli, Francesco
Médium:	Journal Article
Jazyk:	angličtina
Vydáno:	Piscataway IEEE 01.08.2022 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Témata:	Algorithms Artificial intelligence Artificial intelligence (AI) cloud computing cyber-physical system Deep learning Downtime Explainable artificial intelligence explainable artificial intelligence (XAI) Fourth Industrial Revolution Hidden Markov models Industrial applications Industries Industry 4.0 Internet of Things (IoT) Machine learning Manufacturing Predictive maintenance Robots Service robots
ISSN:	1551-3203, 1941-0050
On-line přístup:	Získat plný text
Tagy:	Přidat tag Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!

Abstract	Nowadays, Industry 4.0 can be considered a reality, a paradigm integrating modern technologies and innovations. Artificial intelligence (AI) can be considered the leading component of the industrial transformation enabling intelligent machines to execute tasks autonomously such as self-monitoring, interpretation, diagnosis, and analysis. AI-based methodologies (especially machine learning and deep learning support manufacturers and industries in predicting their maintenance needs and reducing downtime. Explainable artificial intelligence (XAI) studies and designs approaches, algorithms and tools producing human-understandable explanations of AI-based systems information and decisions. This article presents a comprehensive survey of AI and XAI-based methods adopted in the Industry 4.0 scenario. First, we briefly discuss different technologies enabling Industry 4.0. Then, we present an in-depth investigation of the main methods used in the literature: we also provide the details of what, how, why, and where these methods have been applied for Industry 4.0. Furthermore, we illustrate the opportunities and challenges that elicit future research directions toward responsible or human-centric AI and XAI systems, essential for adopting high-stakes industry applications.
AbstractList	Nowadays, Industry 4.0 can be considered a reality, a paradigm integrating modern technologies and innovations. Artificial intelligence (AI) can be considered the leading component of the industrial transformation enabling intelligent machines to execute tasks autonomously such as self-monitoring, interpretation, diagnosis, and analysis. AI-based methodologies (especially machine learning and deep learning support manufacturers and industries in predicting their maintenance needs and reducing downtime. Explainable artificial intelligence (XAI) studies and designs approaches, algorithms and tools producing human-understandable explanations of AI-based systems information and decisions. This article presents a comprehensive survey of AI and XAI-based methods adopted in the Industry 4.0 scenario. First, we briefly discuss different technologies enabling Industry 4.0. Then, we present an in-depth investigation of the main methods used in the literature: we also provide the details of what, how, why, and where these methods have been applied for Industry 4.0. Furthermore, we illustrate the opportunities and challenges that elicit future research directions toward responsible or human-centric AI and XAI systems, essential for adopting high-stakes industry applications.
Author	Ahmed, Imran Piccialli, Francesco Jeon, Gwanggil
Author_xml	– sequence: 1 givenname: Imran orcidid: 0000-0002-7751-286X surname: Ahmed fullname: Ahmed, Imran email: imran.ahmed@imsciences.edu.pk organization: Center of Excellence in Information Technology, Institute of Management Sciences, Hayatabad, Peshawar, Pakistan – sequence: 2 givenname: Gwanggil orcidid: 0000-0002-0651-4278 surname: Jeon fullname: Jeon, Gwanggil email: gjeon@inu.ac.kr organization: Department of Embedded Systems Engineering, Incheon National University, Incheon, South Korea – sequence: 3 givenname: Francesco orcidid: 0000-0002-5179-2496 surname: Piccialli fullname: Piccialli, Francesco email: francesco.piccialli@unina.it organization: Department of Mathematics and Applications "R.Caccioppoli,", University of Naples Federico II, Naples, Italy
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Cites_doi	10.1016/j.jmsy.2017.02.007 10.1016/j.datak.2020.101850 10.1109/CyberSA49311.2020.9139655 10.1109/MESA.2018.8449150 10.1109/DCOSS49796.2020.00043 10.2478/mspe-2020-0014 10.1109/SCSP.2016.7501015 10.1016/j.compositesb.2021.109160 10.1109/ACCESS.2019.2895302 10.1109/INDIN.2016.7819154 10.1016/j.cmrp.2019.04.001 10.3390/risks8040137 10.1007/s11465-018-0499-5 10.1109/TII.2018.2866549 10.1007/s40436-017-0203-8 10.1016/j.promfg.2017.07.091 10.1016/j.cities.2019.01.032 10.3390/en10050610 10.1016/j.ymssp.2021.108105 10.1007/978-3-319-57870-5_16 10.1016/j.compind.2020.103222 10.1287/mnsc.2021.4190 10.1631/FITEE.1800573 10.1109/MetroInd4.0IoT48571.2020.9138181 10.1016/j.bdr.2021.100190 10.1016/j.promfg.2017.07.148 10.1109/TVT.2018.2890416 10.1016/j.ijpe.2014.12.031 10.1109/FUZZ48607.2020.9177537 10.1109/SMC.2019.8913901 10.1177/2158244016653987 10.1002/widm.1379 10.1016/j.chb.2015.02.026 10.1109/ACCESS.2018.2871724 10.1109/TII.2018.2842821 10.1145/3366424.3383110 10.1520/SSMS20190029 10.1007/s12652-018-0998-6 10.1109/TIE.2017.2767540 10.3390/fi11040094 10.1007/s10845-018-1433-8 10.1007/s13218-019-00586-1 10.1002/int.22472 10.3390/smartcities3040065 10.1016/j.jmsy.2018.10.001 10.1109/IMIS.2013.79 10.1016/j.procir.2016.08.005 10.1109/JIOT.2017.2787779 10.3390/s19183987 10.1007/978-3-030-50334-5_4 10.18653/v1/N16-3020 10.1080/0951192X.2019.1571238 10.1016/j.cirp.2019.05.010 10.1016/j.inffus.2019.12.012 10.1007/978-3-030-64949-4_1 10.1109/IEEM.2014.7058728 10.1007/978-3-030-85910-7_31 10.4018/978-1-7998-5101-1.ch003 10.1142/S2424862217500142 10.1016/j.compeleceng.2020.106717 10.1016/j.promfg.2017.09.035 10.21767/2349-3917.100017 10.1016/j.ijpe.2019.01.004 10.1007/s00170-019-04203-1 10.1007/978-3-030-57997-5_8 10.1108/JMTM-02-2018-0057 10.1016/j.inffus.2018.10.005 10.1109/TIE.2018.2807414 10.1007/978-3-319-23784-8_2 10.1109/ACCESS.2019.2914181 10.1142/S2424862217500117 10.1145/3328485
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References	ref57 ref13 ref56 ref12 ref59 ref15 ref58 ref14 ref53 ref52 ref55 ref54 ref10 ref17 ref16 ref19 ref18 bougdira (ref11) 2019 ref50 ref46 ref48 ref42 lundberg (ref51) 2017 ref41 ref44 ref43 chawla (ref60) 2020; 7 krupitzer (ref62) 2020 ref8 ref9 ref4 ref3 ref6 ref5 ref82 ref81 ref40 ref84 ref83 darraj (ref73) 0 penumuru (ref24) 2019 ref80 zhou (ref27) 2020 arya (ref47) 2019 ref79 ref35 ref78 ref34 ref37 ref36 ref31 ref74 ref30 ref77 ref33 ref76 ref32 ref2 ref1 ref39 ref38 ying (ref49) 2019; 32 ref71 ref70 ref72 chang (ref75) 0 ref68 ref67 ref23 ref26 ref69 ref25 ref64 ref20 ref63 ref66 ref22 ref65 ref21 ref28 ref29 kharal (ref45) 2020 ref61 bahrin (ref7) 2016; 78
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10.1016/j.cmrp.2019.04.001 – ident: ref39 doi: 10.3390/risks8040137 – ident: ref81 doi: 10.1007/s11465-018-0499-5 – year: 2019 ident: ref47 article-title: One explanation does not fit all: A toolkit and taxonomy of ai explainability techniques – ident: ref21 doi: 10.1109/TII.2018.2866549 – ident: ref64 doi: 10.1007/s40436-017-0203-8 – ident: ref25 doi: 10.1016/j.promfg.2017.07.091 – ident: ref54 doi: 10.1016/j.cities.2019.01.032 – ident: ref10 doi: 10.3390/en10050610 – ident: ref44 doi: 10.1016/j.ymssp.2021.108105 – volume: 32 year: 2019 ident: ref49 article-title: Gnnexplainer: Generating explanations for graph neural networks publication-title: Adv Neural Inf Process Syst – ident: ref72 doi: 10.1007/978-3-319-57870-5_16 – ident: ref26 doi: 10.1016/j.compind.2020.103222 – ident: ref41 doi: 10.1287/mnsc.2021.4190 – ident: ref74 doi: 10.1631/FITEE.1800573 – ident: ref28 doi: 10.1109/MetroInd4.0IoT48571.2020.9138181 – ident: ref84 doi: 10.1016/j.bdr.2021.100190 – ident: ref6 doi: 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ident: ref32 doi: 10.1145/3366424.3383110 – ident: ref36 doi: 10.1520/SSMS20190029 – ident: ref16 doi: 10.1007/s12652-018-0998-6 – ident: ref19 doi: 10.1109/TIE.2017.2767540 – ident: ref76 doi: 10.3390/fi11040094 – ident: ref1 doi: 10.1007/s10845-018-1433-8 – ident: ref33 doi: 10.1007/s13218-019-00586-1 – ident: ref31 doi: 10.1002/int.22472 – year: 2020 ident: ref27 article-title: The main trends for multi-tier supply chain in Industry 4.0 based on natural language processing publication-title: Comput Ind – ident: ref55 doi: 10.3390/smartcities3040065 – ident: ref13 doi: 10.1016/j.jmsy.2018.10.001 – ident: ref53 doi: 10.1109/IMIS.2013.79 – ident: ref9 doi: 10.1016/j.procir.2016.08.005 – ident: ref23 doi: 10.1109/JIOT.2017.2787779 – year: 2020 ident: ref45 article-title: Explainable artificial intelligence based fault diagnosis and insight harvesting for steel plates manufacturing – ident: ref29 doi: 10.3390/s19183987 – start-page: 132 year: 0 ident: ref73 article-title: Artificial intelligence cybersecurity framework: Preparing for the here and now with AI publication-title: Proc 18th Eur Conf Cyber Warfare Security Acad Conf Publishing Limited – ident: ref63 doi: 10.1007/978-3-030-50334-5_4 – ident: ref50 doi: 10.18653/v1/N16-3020 – ident: ref15 doi: 10.1080/0951192X.2019.1571238 – ident: ref70 doi: 10.1016/j.cirp.2019.05.010 – ident: ref48 doi: 10.1016/j.inffus.2019.12.012 – ident: ref43 doi: 10.1007/978-3-030-64949-4_1 – ident: ref56 doi: 10.1109/IEEM.2014.7058728 – ident: ref67 doi: 10.1007/978-3-030-85910-7_31 – ident: ref38 doi: 10.4018/978-1-7998-5101-1.ch003 – ident: ref5 doi: 10.1142/S2424862217500142 – ident: ref77 doi: 10.1016/j.compeleceng.2020.106717 – ident: ref68 doi: 10.1016/j.promfg.2017.09.035 – ident: ref4 doi: 10.21767/2349-3917.100017 – ident: ref69 doi: 10.1016/j.ijpe.2019.01.004 – ident: ref14 doi: 10.1007/s00170-019-04203-1 – ident: ref66 doi: 10.1007/978-3-030-57997-5_8 – ident: ref8 doi: 10.1108/JMTM-02-2018-0057 – ident: ref12 doi: 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Snippet	Nowadays, Industry 4.0 can be considered a reality, a paradigm integrating modern technologies and innovations. Artificial intelligence (AI) can be considered...
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SubjectTerms	Algorithms Artificial intelligence Artificial intelligence (AI) cloud computing cyber-physical system Deep learning Downtime Explainable artificial intelligence explainable artificial intelligence (XAI) Fourth Industrial Revolution Hidden Markov models Industrial applications Industries Industry 4.0 Internet of Things (IoT) Machine learning Manufacturing Predictive maintenance Robots Service robots
Title	From Artificial Intelligence to Explainable Artificial Intelligence in Industry 4.0: A Survey on What, How, and Where
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