Use of Plasma Information in Machine-Learning-Based Fault Detection and Classification for Advanced Equipment Control
For advanced equipment control, two schemata of real-time fault detection were performed using machine learning algorithms in silicon etching in SF 6 /O 2 /Ar plasma. Fault detection and classification is investigated with the plasma state information with optical emission spectroscopy (OES) data to...
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| Vydané v: | IEEE transactions on semiconductor manufacturing Ročník 34; číslo 3; s. 408 - 419 |
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| Hlavní autori: | , |
| Médium: | Journal Article |
| Jazyk: | English |
| Vydavateľské údaje: |
New York
IEEE
01.08.2021
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Predmet: | |
| ISSN: | 0894-6507, 1558-2345 |
| On-line prístup: | Získať plný text |
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